Gas enclosure assembly and system

ABSTRACT

The present teachings relate to various embodiments of an hermetically-sealed gas enclosure assembly and system that can be readily transportable and assemblable and provide for maintaining a minimum inert gas volume and maximal access to various devices and apparatuses enclosed therein. Various embodiments of an hermetically-sealed gas enclosure assembly and system of the present teachings can have a gas enclosure assembly constructed in a fashion that minimizes the internal volume of a gas enclosure assembly, and at the same time optimizes the working space to accommodate a variety of footprints of various OLED printing systems. Various embodiments of a gas enclosure assembly so constructed additionally provide ready access to the interior of a gas enclosure assembly from the exterior during processing and readily access to the interior for maintenance, while minimizing downtime.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation application of U.S. application Ser.No. 15/605,806, filed May 25, 2017. U.S. application Ser. No. 15/605,806is a continuation of U.S. application Ser. No. 14/543,786, filed Nov.17, 2104. U.S. application Ser. No. 14/543,786 divisional of U.S.application Ser. No. 13/720,830, filed Dec. 19, 2012 and published Dec.2, 2014, as U.S. Pat. No. 8,899,171. U.S. application Ser. No.13/720,830 claims benefit of U.S. application No. 61/579,233, filed Dec.22, 2011, and is additionally a continuation-in-part of U.S. applicationSer. No. 12/652,040, filed Jan. 5, 2010, and published Feb. 26, 2013, asU.S. Pat. No. 8,383,202. U.S. application Ser. No. 12/652,040 claimsbenefit of U.S. Application No. 61/142,575, filed Jan. 5, 2009, and isadditionally a continuation-in-part of U.S. application Ser. No.12/139,391, filed on Jun. 13, 2008, and published Dec. 18, 2008, as US2008/0311307. All cross-referenced applications listed herein areincorporated by reference in their entirety.

FIELD

The present teachings relate to various embodiments of anhermetically-sealed gas enclosure assembly and system that can bereadily transportable and assemblable and provide for maintaining aminimum inert gas volume and maximal access to various devices andapparatuses enclosed therein.

BACKGROUND

Interest in the potential of OLED display technology has been driven byOLED display technology attributes that include demonstration of displaypanels that have highly saturated colors, are high-contrast, ultrathin,fast-responding, and energy efficient. Additionally, a variety ofsubstrate materials, including flexible polymeric materials, can be usedin the fabrication of OLED display technology. Though the demonstrationof displays for small screen applications; primarily cell phones, hasserved to emphasize the potential of the technology, challenges remainin scaling the fabrication to larger formats. For example, fabricationof OLED displays on substrates larger than Gen 5.5 substrates, whichhave dimensions of about 130 cm×150 cm, have yet to be demonstrated.

An organic light-emitting diode (OLED) device may be manufactured by theprinting of various organic thin films, as well as other materials on asubstrate using an OLED printing system. Such organic materials can besusceptible to damage by oxidation and other chemical processes. Housingan OLED printing system in a fashion that can be scaled for varioussubstrate sizes and can be done in an inert, substantially particle-freeprinting environment can present a variety of challenges. As theequipment for printing large-format panel substrate printing requiressubstantial space, maintaining a large facility under an inertatmosphere continuously requiring gas purification to remove reactiveatmospheric species, such as water vapor and oxygen, as well as organicsolvent vapors presents significant engineering challenges. For example,providing a large facility that is hermetically sealed can presentengineering challenges. Additionally, various cabling, wiring and tubingfeeding into and out of an OLED printing system for operating theprinting system can present challenges for effectively bringing a gasenclosure into specification with respect to levels of atmosphericconstituents, such as oxygen and water vapor, as they can createsignificant dead volume in which such reactive species can be occluded.Further, it is desirable for such a facility kept in an inertenvironment for processing to provide ready access for maintenance withminimum downtime. In addition to being substantially free of reactivespecies, a printing environment for OLED devices requires asubstantially low particle environment. In that regard, providing andmaintaining a substantially particle-free environment in an entireenclosed system provides additional challenges not presented by particlereduction for processes that can be done in atmospheric conditions, suchas under open air, high flow laminar flow filtration hoods.

Accordingly, there exists a need for various embodiments of a gasenclosure that can house an OLED printing system, in an inert,substantially particle-free environment, and that can be readily scaledto provide for fabrication of OLED panels on a variety of substratessizes and substrate materials, while also providing for ready access toan OLED printing system from the exterior during processing and readyaccess to the interior for maintenance with minimal downtime.

BRIEF DESCRIPTION OF THE DRAWINGS

A better understanding of the features and advantages of the presentdisclosure will be obtained by reference to the accompanying drawings,which are intended to illustrate, not limit, the present teachings.

FIG. 1 is a schematic of a gas enclosure assembly and system inaccordance with various embodiments of the present teachings.

FIG. 2 is left, front perspective view of a gas enclosure assembly andsystem in accordance with various embodiments of the present teachings.

FIG. 3 is right, front perspective view of a gas enclosure assembly inaccordance with various embodiments of the present teachings.

FIG. 4 depicts an exploded view of a gas enclosure assembly inaccordance with various embodiments of the present teachings.

FIG. 5 is an exploded front perspective view of a frame member assemblydepicting various panel frame sections, and section panels in accordancewith various embodiments of the present teachings.

FIG. 6A is a rear perspective view of a gloveport cap, while FIG. 6B isan expanded view of a shoulder screw of a gloveport cap according tovarious embodiments of a gas enclosure assembly of the presentteachings.

FIG. 7A is an expanded perspective view of a bayonet latch of agloveport capping assembly, while FIG. 7B is a section view of agloveport capping assembly showing the engagement of the head of ashoulder screw with the recess in a bayonet latch.

FIGS. 8A-8C are top schematic views of various embodiments of gasketseals for forming joints.

FIG. 9A and FIG. 9B are various perspective views that depict sealing offrame members according to various embodiments of a gas enclosureassembly of the present teachings.

FIGS. 10A-10B are various views relating to sealing of a section panelfor receiving a readily-removable service window according to variousembodiments of a gas enclosure assembly of the present teachings.

FIGS. 11A-11B are enlarged perspective section views relating to sealingof a section panel for receiving an inset panel or window panelaccording to various embodiments of the present teachings.

FIG. 12A is a base including a pan and a plurality of spacer blocksresting thereon in accordance with various embodiments of the presentteachings. FIG. 12B is an expanded perspective view of a spacer block asindicated in FIG. 12A.

FIG. 13 is an exploded view of wall frame members and a ceiling memberin relationship to a pan in accordance with various embodiments of thepresent teachings.

FIG. 14A is a perspective view of a stage of construction of a gasenclosure assembly with lifter assemblies in a raised position inaccordance with various embodiments of the present teachings. FIG. 14Bis an exploded view of a lifter assembly as indicated in FIG. 14A.

FIG. 15 is a phantom front perspective view of a gas enclosure assembly,which depicts ductwork installed in the interior of a gas enclosureassembly in accordance with various embodiments of the presentteachings.

FIG. 16 is a phantom top perspective view of a gas enclosure assembly,which depicts ductwork installed in the interior of a gas enclosureassembly in accordance with various embodiments of the presentteachings.

FIG. 17 is a phantom bottom perspective view of a gas enclosureassembly, which depicts ductwork installed in the interior of a gasenclosure assembly in accordance with various embodiments of the presentteachings.

FIG. 18A is a schematic representation showing bundles of cables, wires,and tubings, and the like. FIG. 18B depicts gas sweeping past suchbundles that are fed through various embodiments of ductwork accordingto the present teachings.

FIG. 19 is a schematic representation showing how reactive species (A)occluded in dead-spaces of bundles of cables, wires, and tubings and thelike are actively purged from inert gas (B) sweeping through a ductthrough which the bundles have been routed.

FIG. 20A is a phantom perspective view of cables and tubing routedthrough ducting according to various embodiments of a gas enclosureassembly and system of the present teachings. FIG. 20B is an enlargedview of an opening shown in FIG. 20A, showing detail of a cover forclosure over the opening, according to various embodiments of a gasenclosure assembly of the present teachings.

FIG. 21 is a view of a ceiling including a lighting system for a gasenclosure assembly and system in accordance with various embodiments ofthe present teachings.

FIG. 22 is a graph depicting a LED light spectrum of a lighting systemfor a gas enclosure assembly and system components in accordance withvarious embodiments of the present teachings.

FIG. 23 is a front perspective view of view of a gas enclosure assemblyin accordance with various embodiments of the present teachings.

FIG. 24 depicts an exploded view of various embodiments of a gasenclosure assembly and related system components as depicted in FIG. 23in accordance with various embodiments of the present teachings.

FIG. 25 is a schematic view of for various embodiments of gas enclosureassembly and related system components the present teachings.

FIG. 26 is a schematic diagram of a gas enclosure assembly and systemdepicting an embodiment of gas circulation through a gas enclosureassembly according to various embodiments of the present teachings.

FIG. 27 is a schematic diagram of a gas enclosure assembly and systemdepicting an embodiment of gas circulation through a gas enclosureassembly according to various embodiments of the present teachings.

FIG. 28 is a cross-sectional schematic view of a gas enclosure assemblyin accordance with various embodiments of the present teachings.

FIG. 29 is a schematic of a gas enclosure assembly and system inaccordance with various embodiments of the present teachings.

FIG. 30 is a schematic of a gas enclosure assembly and system inaccordance with various embodiments of the present teachings.

FIG. 31 is a table showing valve positions for various modes ofoperation of a gas enclosure assembly and system that can utilize anexternal gas loop in accordance with various embodiments of the presentteachings.

DETAILED DESCRIPTION OF THE DISCLOSURE

The present teachings disclose various embodiments of a gas enclosureassembly that can be sealably constructed and integrated with gascirculation, filtration and purification components to form a gasenclosure assembly and system that can sustain an inert, substantiallyparticle-free environment for processes requiring such an environment.Such embodiments of a gas enclosure assembly and system can maintainlevels for each species of various reactive species, including variousreactive atmospheric gases, such as water vapor and oxygen, as well asorganic solvent vapors at 100 ppm or lower, for example, at 10 ppm orlower, at 1.0 ppm or lower, or at 0.1 ppm or lower. Further, variousembodiments of a gas enclosure assembly can provide a low particleenvironment meeting ISO 14644 Class 3 and Class 4 clean room standards.

One of ordinary skill in a variety of arts may recognize the utility ofembodiments of a gas enclosure assembly to a variety of technologyareas. While vastly different arts such as chemistry, biotechnology,high technology and pharmaceutical arts may benefit from the presentteachings, OLED printing is used to exemplify the utility of variousembodiments of a gas enclosure assembly and system according to thepresent teachings. Various embodiments of a gas enclosure assemblysystem that may house an OLED printing system can provide features suchas, but not limited by, sealing providing an hermetic-sealed enclosurethrough cycles of construction and deconstruction, minimization ofenclosure volume, and ready access from the exterior to the interiorduring processing, as well as during maintenance. As will be discussedsubsequently, such features of various embodiments of a gas enclosureassembly may have an impact on functionality, such as, but not limitedby, structural integrity providing ease of maintaining low levels ofreactive species during processing, as well as rapid enclosure-volumeturnover minimizing downtime during maintenance cycles. As such, variousfeatures and specifications providing utility for OLED panel printingmay also provide benefit to a variety of technology areas.

As previously mentioned, fabrication of OLED displays on substrateslarger than Gen 5.5 substrates, which have dimensions of about 130cm×150 cm, have yet to be demonstrated. Generations of mother glasssubstrate sizes have been undergoing evolution for flat panel displaysfabricated by other-than OLED printing since about the early 1990's. Thefirst generation of mother glass substrates, designated as Gen 1, isapproximately 30 cm×40 cm, and therefore could produce a 15″ panel.Around the mid-1990's, the existing technology for producing flat paneldisplays had evolved to a mother glass substrate size of Gen 3.5, whichhas dimensions of about 60 cm×72 cm.

As generations have advanced, mother glass sizes for Gen 7.5 and Gen 8.5are in production for other-than OLED printing fabrication processes. AGen 7.5 mother glass has dimensions of about 195 cm×225 cm, and can becut into eight 42″ or six 47″ flat panels per substrate. The motherglass used in Gen 8.5 is approximately 220×250 cm, and can be cut to six55″ or eight 46″ flat panels per substrate. The promise of OLED flatpanel display for qualities such as truer color, higher contrast,thinness, flexibility, transparency, and energy efficiency have beenrealized, at the same time that OLED manufacturing is practicallylimited to G 3.5 and smaller. Currently, OLED printing is believed to bethe optimal manufacturing technology to break this limitation and enableOLED panel manufacturing for not only mother glass sizes of Gen 3.5 andsmaller, but at the largest mother glass sizes, such as Gen 5.5, Gen7.5, and Gen 8.5. One of ordinary skill in the art will appreciate thatone of the features of OLED panel printing includes that a variety ofsubstrate materials can be used, for example, but not limited by, avariety of glass substrate materials, as well as a variety of polymericsubstrate materials. In that regard, sizes recited from the terminologyarising from the use of glass-based substrates can be applied tosubstrates of any material suitable for use in OLED printing.

With respect to OLED printing, according to the present teachings,maintaining substantially low levels of reactive species, for example,but not limited by, atmospheric constituents such as oxygen and watervapor, as well as various organic solvent vapors used in OLED inks, hasbeen found to correlate to providing OLED flat panel displays meetingthe requisite lifetime specifications. The lifetime specification is ofparticular significance for OLED panel technology, as this correlatesdirectly to display product longevity; a product specification for allpanel technologies, which is currently challenging for OLED paneltechnology to meet. In order to provide panels meeting requisitelifetime specifications, levels of each of a reactive species, such aswater vapor, oxygen, as well as organic solvent vapors, can bemaintained at 100 ppm or lower, for example, at 10 ppm or lower, at 1.0ppm or lower, or at 0.1 ppm or lower with various embodiments of a gasenclosure assembly system of the present teachings. Additionally, OLEDprinting requires a substantially particle-free environment. Maintaininga substantially particle-free environment for OLED printing is ofparticular importance, as even very small particles can lead to avisible defect on an OLED panel. Currently, it is a challenge for OLEDdisplays to meet the required low defect levels for commercialization.Maintaining a substantially particle-free environment in an entireenclosed system provides additional challenges not presented by particlereduction for processes that can be done in atmospheric conditions, suchas under open air, high flow laminar flow filtration hoods. As such,maintaining the requisite specifications for an inert, particle-freeenvironment in a large facility can present a variety of challenges.

The need for printing an OLED panel in a facility in which the levels ofeach of a reactive species, such as water vapor, oxygen, as well asorganic solvent vapors, can be maintained at 100 ppm or lower, forexample, at 10 ppm or lower, at 1.0 ppm or lower, or at 0.1 ppm orlower, can be illustrated in reviewing the information summarized inTable 1. The data summarized on Table 1 resulted from the testing ofeach of a test coupon comprising organic thin film compositions for eachof red, green, and blue, fabricated in a large-pixel, spin-coated deviceformat. Such test coupons are substantially easier to fabricate and testfor the purpose of rapid evaluation of various formulations andprocesses. Though test coupon testing should not be confused withlifetime testing of a printed panel, it can be indicative of the impactof various formulations and processes on lifetime. The results shown inthe table below represent variation in the process step in thefabrication of test coupons in which only the spin-coating environmentvaried for test coupons fabricated in a nitrogen environment wherereactive species were less than 1 ppm compared to test coupons similarlyfabricated but in air instead of a nitrogen environment.

It is evident through the inspection of the data in Table 1 for testcoupons fabricated under different processing environments, particularlyin the case of red and blue, that printing in an environment thateffectively reduces exposure of organic thin film compositions toreactive species may have a substantial impact on the stability ofvarious ELs, and hence on lifetime.

TABLE 1 Impact of inert gas processing on lifetime for OLED panels VProcess @ 10 Cd/A CIE (x,y) T95 T80 T50 Color Environment mA/cm² @ 1000Cd/m² Red Nitrogen 6 9 (0.61, 0.38) 200 1750 10400 Air 6 8 (0.60, 0.39) 30  700  5600 Green Nitrogen 7 66  (0.32, 0.63) 250 3700 32000 Air 761  (0.32, 0.62) 250 2450 19700 Blue Nitrogen 4 5 (0.14, 0.10) 150  750 3200 Air 4 5 (0.14, 0.10)  15  250  1800

As such, challenges exist in scaling OLED printing from Gen 3.5 to Gen8.5 and greater, and at the same time providing for a robust enclosuresystem that can contain an OLED printing system in an inert,substantially particle-free gas enclosure environment. It iscontemplated that according to the present teachings, such a gasenclosure would have attributes that include, for example, but are notlimited by, a gas enclosure that can be readily scaled to provide anoptimized working space for an OLED printing system, while providingminimized inert gas volume, and additionally providing ready access toan OLED printing system from the exterior during processing, whileproviding access to the interior for maintenance with minimal downtime.

According to various embodiments of the present teachings, a gasenclosure assembly for various air-sensitive processes that require aninert environment is provided that can include a plurality of wall frameand ceiling frame members that can be sealed together. In someembodiments, a plurality of wall frame and ceiling frame members can befastened together using reusable fasteners, for example, bolts andthreaded holes. For various embodiments of a gas enclosure assemblyaccording to the present teachings, a plurality of frame members, eachframe member comprising a plurality of panel frame sections, can beconstructed to define a gas enclosure frame assembly.

A gas enclosure assembly of the present teachings can be designed toaccommodate a system, such as an OLED printing system, in a fashion thatcan minimize the volume of the enclosure around a system. Variousembodiments of a gas enclosure assembly can be constructed in a fashionthat minimizes the internal volume of a gas enclosure assembly, and atthe same time optimizes the working space to accommodate variousfootprints of various OLED printing systems. Various embodiments of agas enclosure assembly so constructed additionally provide ready accessto the interior of a gas enclosure assembly from the exterior duringprocessing and readily access to the interior for maintenance, whileminimizing downtime. In that regard, various embodiments of a gasenclosure assembly according to the present teachings can be contouredwith respect to various footprints of various OLED printing systems.According to various embodiments, once the contoured fame members areconstructed to form a gas enclosure frame assembly, various types ofpanels may be sealably installed in a plurality of panel sectionscomprising a frame member to complete the installation of a gasenclosure assembly. In various embodiments of a gas enclosure assembly,a plurality of frame members including, for example, but not limited by,a plurality of wall frame members and at least one ceiling frame member,as well as a plurality of panels for installation in panel framesections, may be fabricated at one location or locations, and thenconstructed at another location. Moreover, given the transportablenature of components used to construct a gas enclosure assembly of thepresent teachings, various embodiments of a gas enclosure assembly canbe repeatedly installed and removed through cycles of construction anddeconstruction.

In order to ensure that a gas enclosure is hermetically sealed, variousembodiments of a gas enclosure assembly of the present teaching providefor joining each frame member to provide frame sealing. The interior canbe sufficiently sealed, for example, hermetically sealed, bytight-fitting intersections between the various frame members, whichinclude gaskets or other seals. Once fully constructed, a sealed gasenclosure assembly can comprise an interior and a plurality of interiorcorner edges, at least one interior corner edge provided at theintersection of each frame member with an adjacent frame member. One ormore of the frame members, for example, at least half of the framemembers, can comprise one or more compressible gaskets fixed along oneor more respective edges thereof. The one or more compressible gasketscan be configured to create an hermetically sealed gas enclosureassembly once a plurality of frame members are joined together, andgas-tight panels installed. A sealed gas enclosure assembly can beformed having corner edges of frame members sealed by a plurality ofcompressible gaskets. For each frame member, for example, but notlimited by, an interior wall frame surface, a top wall frame surface, avertical side wall frame surface, a bottom wall frame surface, and acombination thereof can be provided with one or more compressiblegaskets.

For various embodiments of a gas enclosure assembly, each frame membercan comprise a plurality of sections framed and fabricated to receiveany of a variety of panel types that can be sealably installed in eachsection to provide a gas-tight panel seal for each panel. In variousembodiments of a gas enclosure assembly of the present teachings, eachsection frame can have a section frame gasket that, with selectedfasteners, ensures each panel installed in each section frame canprovide a gas-tight seal for each panel, and therefore for afully-constructed gas enclosure. In various embodiments, a gas enclosureassembly can have one or more of a window panel or service window ineach of a wall panel; where each window panel or service window can haveat least one gloveport. During assembly of a gas enclosure assembly,each gloveport can have a glove attached, so that the glove can extendinto the interior. According to various embodiments, each gloveport canhave hardware for mounting a glove, wherein such hardware utilizesgasket seals around each gloveport that provide a gas-tight seal tominimize leakage or molecular diffusion through the gloveport. Forvarious embodiments of a gas enclosure assembly of the presentteachings, the hardware is further designed for providing ease ofcapping and uncapping a gloveport to an end-user.

Various embodiments of a gas enclosure assembly and system according tothe present teachings can include a gas enclosure assembly formed from aplurality of frame members and panel sections, as well as gascirculation, filtration and purification components. For variousembodiments of a gas enclosure assembly and system, ductwork may beinstalled during the assembly process. According to various embodimentsof the present teachings, ductwork can be installed within a gasenclosure frame assembly, which has been constructed from a plurality offrame members. In various embodiments, ductwork can be installed on aplurality of frame members before they are joined to form a gasenclosure frame assembly. Ductwork for various embodiments of a gasenclosure assembly and system can be configured such that substantiallyall gas drawn into the ductwork from one or more ductwork inlets ismoved through various embodiments of a gas circulation and filtrationloop for removing particulate matter internal to a gas enclosureassembly and system. Additionally, ductwork of various embodiments of agas enclosure assembly and system can be configured to separate theinlets and outlets of a gas purification loop that is external to a gasenclosure assembly from a gas circulation and filtration loop that isinternal to a gas enclosure assembly.

For example, a gas enclosure assembly and system can have a gascirculation and filtration system internal to a gas enclosure assembly.Such an internal filtration system can have a plurality of fan filterunits within the interior, and can be configured to provide a laminarflow of gas within the interior. The laminar flow can be in a directionfrom a top of the interior to a bottom of the interior, or in any otherdirection. Although a flow of gas generated by a circulating system neednot be laminar, a laminar flow of gas can be used to ensure thorough andcomplete turnover of gas in the interior. A laminar flow of gas can alsobe used to minimize turbulence, such turbulence being undesirable as itcan cause particles in the environment to collect in such areas ofturbulence, preventing the filtration system from removing thoseparticles from the environment. Further, to maintain a desiredtemperature in the interior, a thermal regulation system utilizing aplurality of heat exchangers can be provided, for example, operatingwith, adjacent to, or used in conjunction with, a fan or another gascirculating device. A gas purification loop can be configured tocirculate gas from within the interior of a gas enclosure assemblythrough at least one gas purification component exterior the enclosure.In that regard, a circulation and filtration system internal to a gasenclosure assembly in conjunction with a gas purification loop externalto a gas enclosure assembly can provide continuous circulation of asubstantially low-particulate inert gas having substantially low levelsof reactive species throughout a gas enclosure assembly. The gaspurification system can be configured to maintain very low levels ofundesired components, for example, organic solvents and vapors thereof,as well as water, water vapor, oxygen, and the like.

In addition to providing for the gas circulation, filtration andpurification components, the ductwork can be sized and shaped toaccommodate therein at least one of an electrical wire, a wire bundle,as well as various fluid-containing tubings, which when bundled can havea considerable dead volume in which atmospheric constituents, such aswater, water vapor, oxygen, and the like, can be trapped and difficultto remove by the purification system. In some embodiments, a combinationof any of cables, electrical wires and wire bundles, andfluid-containing tubing can be disposed substantially within theductwork and can be operatively associated with at least one of anelectrical system, a mechanical system, a fluidic system and a coolingsystem, respectively, disposed within the interior. As the gascirculation, filtration and purification components can be configuredsuch that substantially all circulated inert gas is drawn through theductwork, atmospheric constituents trapped in the dead volume ofvariously bundled materials can be effectively purged from theconsiderable dead volume of such bundled materials by having suchbundled materials contained within the ductwork.

Various embodiments of a gas enclosure assembly and system according tothe present teachings can include a gas enclosure assembly formed from aplurality of frame members and panel sections, as well as gascirculation, filtration and purification components, and additionallyvarious embodiments of a pressurized inert gas recirculation system.Such a pressurized inert gas recirculation system can be utilized in theoperation of an OLED printing system for various pneumatically-drivendevices and apparatuses, as will be discussed in more detailsubsequently.

According to the present teachings, several engineering challenges wereaddressed in order to provide for various embodiments of a pressurizedinert gas recirculation system in a gas enclosure assembly and system.First, under typical operation of a gas enclosure assembly and systemwithout a pressurized inert gas recirculation system, a gas enclosureassembly can be maintained at a slightly positive internal pressurerelative to an external pressure in order to safeguard against outsidegas or air from entering the interior should any leaks develop in a gasenclosure assembly and system. For example, under typical operation, forvarious embodiments of a gas enclosure assembly and system of thepresent teachings, the interior of a gas enclosure assembly can bemaintained at a pressure relative to the surrounding atmosphere externalto the enclosure system, for example, of at least 2 mbarg, for example,at a pressure of at least 4 mbarg, at a pressure of at least 6 mbarg, ata pressure of at least 8 mbarg, or at a higher pressure. Maintaining apressurized inert gas recirculation system within a gas enclosureassembly system can be challenging, as it presents a dynamic and ongoingbalancing act regarding maintaining a slight positive internal pressureof a gas enclosure assembly and system, while at the same timecontinuously introducing pressurized gas into a gas enclosure assemblyand system. Further, variable demand of various devices and apparatusescan create an irregular pressure profile for various gas enclosureassemblies and systems of the present teachings. Maintaining a dynamicpressure balance for a gas enclosure assembly held at a slight positivepressure relative to the external environment under such conditions canprovide for the integrity of an ongoing OLED printing process.

For various embodiments of a gas enclosure assembly and system, apressurized inert gas recirculation system according to the presentteachings can include various embodiments of a pressurized inert gasloop that can utilize at least one of a compressor, an accumulator, anda blower, and combinations thereof. Various embodiments of a pressurizedinert gas recirculation system that include various embodiments of apressurized inert gas loop can have a specially designedpressure-controlled bypass loop that can provide internal pressure of aninert gas in a gas enclosure assembly and system of the presentteachings at a stable, defined value. In various embodiments of a gasenclosure assembly and system, a pressurized inert gas recirculationsystem can be configured to recirculate pressurized inert gas via apressure-controlled bypass loop when a pressure of an inert gas in anaccumulator of a pressurized inert gas loop exceeds a pre-set thresholdpressure. The threshold pressure can be, for example, within a rangefrom between about 25 psig to about 200 psig, or more specificallywithin a range of between about 75 psig to about 125 psig, or morespecifically within a range from between about 90 psig to about 95 psig.In that regard, a gas enclosure assembly and system of the presentteachings having a pressurized inert gas recirculation system withvarious embodiments of a specially designed pressure-controlled bypassloop can maintain a balance of having a pressurized inert gasrecirculation system in an hermetically sealed gas enclosure.

According to the present teachings, various devices and apparatuses canbe disposed in the interior and in fluid communication with variousembodiments of a pressurized inert gas recirculation system havingvarious pressurized inert gas loops that can utilize a variety ofpressurized gas sources, such as at least one of a compressor, a blower,and combinations thereof. For various embodiments of a gas enclosure andsystem of the present teachings, the use of various pneumaticallyoperated devices and apparatuses can be provide low-particle generatingperformance, as well as being low maintenance. Exemplary devices andapparatuses that can be disposed in the interior of a gas enclosureassembly and system and in fluid communication with various pressurizedinert gas loops can include, for example, but not limited by, one ormore of a pneumatic robot, a substrate floatation table, an air bearing,an air bushing, a compressed gas tool, a pneumatic actuator, andcombinations thereof. A substrate floatation table, as well as airbearings can be used for various aspects of operating an OLED printingsystem in accordance with various embodiments of a gas enclosureassembly of the present teachings. For example, a substrate floatationtable utilizing air-bearing technology can be used to transport asubstrate into position in a print head chamber, as well as to support asubstrate during an OLED printing process.

As previously discussed, various embodiments of a substrate floatationtable, as well as air bearings can be useful for the operation ofvarious embodiments of an OLED printing system housed in a gas enclosureassembly according to the present teachings. As shown schematically inFIG. 1 for gas enclosure assembly and system 2000, a substratefloatation table utilizing air-bearing technology can be used totransport a substrate into position in a print head chamber, as wellsupport a substrate during an OLED printing process. In FIG. 1, a gasenclosure assembly 1500 can be a load-locked system that can have aninlet chamber 1510 for receiving a substrate through first inlet gate1512 and gate 1514 for moving a substrate from inlet chamber 1510 to gasenclosure assembly 1500 for printing. Various gates according to thepresent teachings can be used for isolating the chambers from each otherand from the external surroundings. According to the present teachings,various gates can be a selected from a physical gate and a gas curtain.

During the substrate-receiving process, gate 1512 can be open, whilegate 1514 can be in the closed position in order to prevent atmosphericgases from entering gas enclosure assembly 1500. Once a substrate isreceived in inlet chamber 1510, both gate 1512 and 1514 can be closedand inlet chamber 1510 can be purged with an inert gas, such asnitrogen, any of the noble gases, and any combination thereof, untilreactive atmospheric gases are at a low of level of 100 ppm or lower,for example, at 10 ppm or lower, at 1.0 ppm or lower, or at 0.1 ppm orlower. After atmospheric gases have reached a sufficiently low level,gate 1514 can be opened, while 1512 remains closed, to allow substrate1550, to be transported from inlet chamber 1510 to gas enclosureassembly chamber 1500, as depicted in FIG. 1. The transport of thesubstrate from inlet chamber 1510 to gas enclosure assembly chamber 1500can be via, for example, but not limited by, a floatation table providedin chambers 1500 and 1510. The transport of the substrate from inletchamber 1510 to gas enclosure assembly chamber 1500 can also be via, forexample, but not limited by, a substrate transport robot, which canplace substrate 1550 onto a floatation table provided in chamber 1500.Substrate 1550 can remain supported on a substrate floatation tableduring the printing process.

Various embodiments of gas enclosure assembly and system 2000 can haveoutlet chamber 1520 in fluid communication with gas enclosure assembly1500 through gate 1524. According to various embodiments of gasenclosure assembly and system 2000, after the printing process iscomplete, substrate 1550 can be transported from gas enclosure assembly1500 to outlet chamber 1520 through gate 1524. The transport of thesubstrate from gas enclosure assembly chamber 1500 to outlet chamber1520 can be via, for example, but not limited by, a floatation tableprovided in chambers 1500 and 1520. The transport of the substrate fromgas enclosure assembly chamber 1500 to outlet chamber 1520 can also bevia, for example, but not limited by, a substrate transport robot, whichcan pick up substrate 1550 from a floatation table provided in chamber1500 and transport it into chamber 1520. For various embodiments of gasenclosure assembly and system 2000, substrate 1550 can be retrieved fromoutlet chamber 1520 via gate 1522, when gate 1524 is in a closedposition in order to prevent reactive atmospheric gases from enteringgas enclosure assembly 1500.

In addition to a load-locked system that includes an inlet chamber 1510and an outlet chamber 1520, which are in fluid communication with gasenclosure assembly 1500 via gates 1514 and 1524 respectively, gasenclosure assembly and system 2000 can include system controller 1600.System controller 1600 can include one or more processor circuits (notshown) in communication with one or more memory circuits (not shown).System controller 1600 can also communicate with a load-locked systemthat includes an inlet chamber 1510 and an outlet chamber 1520 andultimately with a print nozzle of an OLED printing system. In thismanner, system controller 1600 can coordinate opening and closing ofgates 1512, 1514, 1522 and 1524. System controller 1600 can also controlink dispensing to a print nozzle of an OLED printing system. Substrate1550 can be transported through various embodiments of a load-lockedsystem of the present teachings that includes an inlet chamber 1510 andan outlet chamber 1520, which are in fluid communication with gasenclosure assembly 1500 via gates 1514 and 1524 respectively, via forexample, but not limited by, a substrate floatation table utilizingair-bearing technology or a combination of floatation tables utilizingair-bearing technology and substrate transport robots.

Various embodiments of a load-locked system of FIG. 1 can also includepneumatic control system 1700, which can include a vacuum source and aninert gas source that can include nitrogen, any of the noble gases, andany combination thereof. A substrate floatation system housed within gasenclosure assembly and system 2000 can include multiple vacuum ports andgas bearing ports, which are typically arranged on a flat surface.Substrate 1550 can be lifted and kept off of a hard surface by thepressure of an inert gas such as nitrogen, any of the noble gases, andany combination thereof. The flow out of the bearing volume isaccomplished by means of multiple vacuum ports. The floating height ofsubstrate 1550 over a substrate floatation table is typically a functionof gas pressure and gas flow. Vacuum and pressure of pneumatic controlsystem 1700 can be used to support substrate 1550 during handling insidethe gas enclosure assembly 1500 in the load-locked system of FIG. 1, forexample, during printing. Control system 1700 can also be used tosupport substrate 1550 during transport through load-locked system ofFIG. 1 that includes an inlet chamber 1510 and an outlet chamber 1520,which are in fluid communication with gas enclosure assembly 1500 viagates 1514 and 1524 respectively. To control transporting substrate 1550through gas enclosure assembly and system 2000, system controller 1600communicates with inert gas source 1710 and vacuum 1720 through valves1712 and 1722, respectively. Additional vacuum and inert gas supplylines and valving, not shown, can be provided to the gas enclosureassembly and system 2000, illustrated by the lock-locked system in FIG.1, to further provide the various gas and vacuum facilities needed forcontrolling the enclosed environment.

To lend a more dimensional perspective to various embodiments of a gasenclosure assembly and system according to the present teachings, FIG. 2is a left front perspective view of various embodiments of gas enclosureassembly and system 2000. FIG. 2 depicts a load-locked system includinggas enclosure assembly 1500, inlet chamber 1510, and first gate 1512.Gas enclosure assembly and system 2000 of FIG. 2 can include a gaspurification system 2130 for providing gas enclosure assembly 1500 witha constant supply of inert gas having substantially low levels ofreactive atmospheric species, such as water vapor and oxygen, as well asorganic solvent vapors that result from an OLED printing process. Gasenclosure assembly and system 2000 of FIG. 2 also has controller system1600 for system control functions, as previously discussed.

FIG. 3 is a right, front perspective view of a fully-constructed gasenclosure assembly 100 according to various embodiments of the presentteachings. Gas enclosure assembly 100 can contain one or more gases formaintaining an inert environment in a gas enclosure assembly interior. Agas enclosure assembly and system of the present teachings can be usefulin maintaining an inert gas atmosphere in the interior. An inert gas maybe any gas that does not undergo a chemical reaction under a defined setof conditions. Some commonly used examples of an inert gas can includenitrogen, any of the noble gases, and any combination thereof. Gasenclosure assembly 100 is configured to encompass and protect anair-sensitive process, such as the printing of an organic light emittingdiode (OLED) ink using an industrial printing system. Examples ofatmospheric gases that are reactive to OLED inks include water vapor andoxygen. As previously discussed, gas enclosure assembly 100 can beconfigured to maintain a sealed atmosphere and allow the component orprinting system to operate effectively while avoiding contamination,oxidation, and damage to otherwise reactive materials and substrates.

As depicted in FIG. 3, various embodiments of a gas enclosure assemblycan comprise component parts including a front or first wall panel 210′,a left, or second wall panel (not shown), a right or third wall panel230′, a back or forth wall panel (not shown), and ceiling panel 250′,which gas enclosure assembly can be attached to pan 204, which rests ona base (not shown). As will be discussed in more detail subsequently,various embodiments of a gas enclosure assembly 100 of FIG. 1 can beconstructed from a front or first wall frame 210, a left, or second wallframe (not shown), a right or third wall frame 230, a back or forth wallpanel (not shown), and a ceiling frame 250. Various embodiments of aceiling frame 250 can include a fan filter unit cover 103, as well asfirst ceiling frame duct 105, and first ceiling frame duct 107.According to embodiments of the present teachings, various types ofsection panels may be installed in any of a plurality of panel sectioncomprising a frame member. In various embodiments of gas enclosureassembly 100 of FIG. 1, sheet metal panel sections 109 can be weldedinto a frame member during the construction of a frame. For variousembodiments of gas enclosure assembly 100, types of section panels canthat can be repeatedly installed and removed through cycles ofconstruction and deconstruction of a gas enclosure assembly can includean inset panel 110, as indicated for wall panel 210′, as well as awindow panel 120 and readily-removable service window 130, as indicatedfor wall panel 230′.

Though readily-removable service window 130 can provide ready access tothe interior of enclosure 100, any panel that is removable can be usedto provide access to the interior of a gas enclosure assembly and systemfor the purpose of repair and regular service. Such access for serviceor repair is differentiated from the access provided by panels such aswindow panel 120 and readily-removable service window 130, which canprovide an end-user glove access to the interior of a gas enclosureassembly during use from the exterior of a gas enclosure assembly. Forexample, any of the gloves, such as glove 142, which is attached togloveport 140, as shown in FIG. 3 for panel 230, can provide an end-useraccess to the interior during use of a gas enclosure assembly system.

FIG. 4 depicts an exploded view of various embodiments of a gasenclosure assembly as depicted in FIG. 3. Various embodiments of a gasenclosure assembly can have a plurality of wall panels, includingoutside perspective view of front wall panel 210′, outside perspectiveview of left wall panel 220′, interior perspective view of a right wallpanel 230′, interior perspective view of rear wall panel 240′, and topperspective view of ceiling panel 250′, which as shown in FIG. 3 can beattached to pan 204, which rests upon base 202. An OLED printing systemcan mounted on top of pan 204, which printing processes are known to besensitive to atmospheric conditions. According to the present teachings,a gas enclosure assembly can be constructed from frame members, forexample, wall frame 210 of wall panel 210′, wall frame 220 of wall panel220′, wall frame 230 of wall panel 230′, wall frame 240 of wall panel240′, and ceiling frame 250 of ceiling panel 250′, in which a pluralityof section panels can then be installed. In that regard, it can bedesirable to streamline the design of section panels that can berepeatedly installed and removed through cycles of construction anddeconstruction of various embodiments of a gas enclosure assembly of thepresent teachings. Moreover, contouring of a gas enclosure assembly 100can be done to accommodate a footprint of various embodiments of an OLEDprinting system in order to minimize the volume of inert gas required ina gas enclosure assembly, as well as providing ready access to anend-user; both during use of a gas enclosure assembly, as well as duringmaintenance.

Using front wall panel 210′ and left wall panel 220′ as exemplary,various embodiments of a frame member can have sheet metal panelsections 109 welded into a frame member during frame memberconstruction. Inset panel 110, window panel 120 and readily-removableservice window 130 can be installed in each of a wall frame member, andcan be repeatedly installed and removed through cycles of constructionand deconstruction of gas enclosure assembly 100 of FIG. 4. As can beseen; in the example of wall panel 210′ and wall panel 220′, a wallpanel can have a window panel 120 proximal to a readily-removableservice window 130. Similarly, as depicted in the example rear wallpanel 240′, a wall panel can have a window panel such as window panel125, which has two adjacent gloveports 140. For various embodiments ofwall frame members according to the present teachings, and as seen forgas enclosure assembly 100 of FIG. 3, such an arrangement of glovesprovides easy access from the exterior of a gas enclosure to componentparts within an enclosed system. Accordingly, various embodiments of agas enclosure can provide two or more gloveports so that an end-user canextend a left glove and a right glove into the interior and manipulateone or more items in the interior, without disturbing the composition ofthe gaseous atmosphere within the interior. For example, any of windowpanel 120 and service window 130 can be positioned to facilitate easyaccess from the exterior of a gas enclosure assembly to an adjustablecomponent in the interior of a gas enclosure assembly. According tovarious embodiments of a window panel, such as window panel 120 andservice window 130, when end-user access through a gloveport glove isnot indicated, such windows may not include a gloveport and gloveportassembly.

Various embodiments of wall and ceiling panels, as depicted in FIG. 4,can have a plurality of an inset panel 110. As can be seen in FIG. 4,inset panels can have a variety of shapes and aspect ratios. In additionto inset panels, ceiling panel 250′ can have a fan filter unit cover 103as well as first ceiling frame duct 105, and second ceiling frame duct107, mounted, bolted, screwed, fixed, or otherwise secured to ceilingframe 250. As will be discussed in more detail subsequently, ductwork influid communication with duct 107 of ceiling panel 250′ can be installedwithin the interior of a gas enclosure assembly. According to thepresent teachings, such ductwork can be part of a gas circulation systeminternal to a gas enclosure assembly, as well as providing forseparating the flow stream exiting a gas enclosure assembly forcirculation through at least one gas purification component external toa gas enclosure assembly.

FIG. 5 is an exploded front perspective view of frame member assembly200, in which wall frame 220 can be constructed to include a completecomplement of panels. Though not limited to the design shown, framemember assembly 200, using wall frame 220, can be used as exemplary forvarious embodiments of a frame member assembly according to the presentteachings. Various embodiments of a frame member assembly can becomprised of various frame members and section panels installed invarious frame panel sections of various frame members according to thepresent teachings.

According to various embodiments of various frame member assemblies ofthe present teachings, frame member assembly 200 can be comprised of aframe member, such as wall frame 220. For various embodiments of a gasenclosure assembly, such as gas enclosure assembly 100 of FIG. 3,processes that may utilize equipment housed in such a gas enclosureassembly may not only require an hermetically sealed enclosure providingan inert environment, but an environment substantially free ofparticulate matter. In that regard, a frame member according to thepresent teachings may utilize variously dimensioned metal tube materialsfor the construction of various embodiments of a frame. Such metal tubematerials address desired material attributes, including, but notlimited by, a high-integrity material that will not degrade to produceparticulate matter, as well as producing a frame member having highstrength, yet optimal weight, providing for ready transport,construction, and deconstruction from one site to another site of a gasenclosure assembly comprising various frame members and panel sections.One of ordinary skill in the art can readily understand that anymaterial satisfying these requirements can be utilized for creatingvarious frame members according to the present teachings.

For example, various embodiments of a frame member according to thepresent teachings, such as frame member assembly 200, can be constructedfrom extruded metal tubing. According to various embodiments of a framemember, aluminum, steel, and a variety of metal composite materials maybe utilized for constructing a frame member. In various embodiments,metal tubing having dimensions of, for example, but not limited by, 2″w×2″ h, 4″ w×2″ h and 4″ w×4″ h and having ⅛″ to ¼″ wall thickness canbe used to construct various embodiments of frame members according tothe present teachings. Additionally, a variety of reinforced fiberpolymeric composite materials of a variety of tube or other forms areavailable that have the material attributes including, but not limitedby, a high-integrity material that will not degrade to produceparticulate matter, as well as producing a frame member having highstrength, yet optimal weight, providing for ready transport,construction, and deconstruction from one site to another site.

Regarding construction of various frame members from variouslydimensioned metal tube materials, it is contemplated that welding tocreate various embodiments of frame weldments can be done. Additionally,construction of various frame members from variously dimensionedbuilding materials can be done using an appropriate industrial adhesive.It is contemplated that the construction of various frame members shouldbe done in a fashion that would not intrinsically create leak pathsthrough a frame member. In that regard, construction of various framemembers can be done using any approach that does not intrinsicallycreate leak paths through a frame member for various embodiments of agas enclosure assembly. Further, various embodiments of frame membersaccording to the present teachings, such as wall frame 220 of FIG. 4,may be painted or coated. For various embodiments of a frame member madefrom a metal tubing material prone, for example, to oxidation, wherematerial formed at the surface may create particulate matter, paintingor coating, or other surface treatment, such as anodizing, to preventthe formation of particulate matter can be done.

A frame member assembly, such as frame member assembly 200 of FIG. 5,can have a frame member, such as wall frame 220. Wall frame 220 can havetop 226, upon which a top wall frame spacer plate 227 can be fastened,as well as a bottom 228, upon which a bottom wall frame spacer plate 229can be fastened. As will be discussed in more detail subsequently,spacer plates mounted on surfaces of a frame member are a part of agasket sealing system, which in conjunction with the gasket sealing ofpanels mounted in frame member sections, provides for hermetic sealingof various embodiments of a gas enclosure assembly according to thepresent teachings. A frame member, such as wall frame 220 of framemember assembly 200 of FIG. 5, can have several panel frame sections,where each section can be fabricated to receive various types of panels,such as, but not limited by, an inset panel 110, a window panel 120 anda readily-removable service window 130. Various types of panel sectionscan be formed in the construction of a frame member. Types of panelsections can include, for example, but not limited by, an inset panelsection 10, for receiving inset panel 110, a window panel section 20,for receiving window panel 120, and a service window panel section 30,for receiving readily-removable service window 130.

Each type of panel section can have a panel section frame to receive apanel, and can provide that each panel can be sealably fastened intoeach panel section in accordance with the present teachings forconstructing an hermetically sealed gas enclosure assembly. For example,in FIG. 5 depicting a frame assembly according to the present teachings,inset panel section 10 is shown to have frame 12, window panel section20 is shown to have frame 22, and service window panel section 30 isshown to have frame 32. For various embodiments of a wall frame assemblyof the present teachings, various panel section frames can be a metalsheet material welded into the panel sections with a continuousweld-bead to provide a hermetic seal. For various embodiments of a wallframe assembly, various panel section frames can be made from a varietyof sheet materials, including building materials selected fromreinforced fiber polymeric composite materials, which can be mounted ina panel section using an appropriate industrial adhesive. As will bediscussed in more detail in subsequent teachings concerning sealing,each panel section frame can have a compressible gasket disposed thereonto ensure that a gas-tight seal can be formed for each panel installedand fastened in each panel section. In addition to a panel sectionframe, each frame member section can have hardware related topositioning a panel, as well as to securely fastening a panel in a panelsection.

Various embodiments of inset panel 110 and panel frame 122 for windowpanel 120 can be constructed from sheet metal material, such as, but notlimited by, aluminum, various alloys of aluminum and stainless steel.The attributes for the panel material can be the same as they are forthe structural material constituting various embodiments of framemembers. In that regard, materials having attributes for various panelmembers include, but not are limited by, a high integrity material thatwill not degrade to produce particulate matter, as well as producing apanel having high strength, yet optimal weight, in order to provide forready transport, construction, and deconstruction from one site toanother site. Various embodiments of, for example, honeycomb core sheetmaterial can have the requisite attributes for use as panel material forconstruction of inset panel 110 and panel frame 122 for window panel120. Honeycomb core sheet material can be made of a variety ofmaterials; both metal, as well as metal composite and polymeric, as wellas polymer composite honeycomb core sheet material. Various embodimentsof removable panels when fabricated from a metal material can haveground connections included in the panel to ensure that when a gasenclosure assembly is constructed that the entire structure is grounded.

Given the transportable nature of gas enclosure assembly components usedto construct a gas enclosure assembly of the present teachings, any ofthe various embodiments of section panels of the present teachings canbe repeatedly installed and removed during use of a gas enclosureassembly and system to provide access to the interior of a gas enclosureassembly.

For example, panel section 30 for receiving a readily-removable servicewindow panel 130 can have a set of four spacers, of which one isindicated as window guide spacer 34. Additionally, panel section 30,which is constructed for receiving a readily-removable service windowpanel 130, can have a set of four clamping cleats 36, which can be usedto clamp service window 130 into service window panel section 30 using aset of four of a reverse acting toggle clamp 136 mounted on servicewindow frame 132 for each of a readily removable service window 130.Further, two of each of a window handle 138 can be mounted onreadily-removable service window frame 132 to provide an end-user easeof removal and installation of service window 130. The number, type, andplacement of removable service window handles can be varied.Additionally, service window panel section 30 for receiving areadily-removable service window panel 130 can have at least two of awindow clamp 35, selectively installed in each service window panelsection 30. Though depicted as in the top and bottom of each of servicewindow panel section 30, at least two window clamps can be installed inany fashion that acts to secure service window 130 in panel sectionframe 32. A tool can be used to remove and install window clamp 35, inorder to allow service window 130 to be removed and reinstalled.

Reverse acting toggle clamp 136 of service window 130, as well ashardware installed on panel section 30, including clamping cleat 36,window guide spacer 34, and window clamp 35, can be constructed of anysuitable material, as well as combination of materials. For example, oneor more such elements can comprise at least one metal, at least oneceramic, at least one plastic, and a combination thereof. Removableservice window handle 138 can be constructed of any suitable material,as well as a combination of materials. For example, one or more suchelements can comprise at least one metal, at least one ceramic, at leastone plastic, at least one rubber, and a combination thereof. Enclosurewindows, such as window 124 of window panel 120, or window 134 ofservice window 130, can comprise any suitable material as well as acombination of materials. According to various embodiments of a gasenclosure assembly of the present teachings, enclosure windows cancomprise a transparent and a translucent material. In variousembodiments of a gas enclosure assembly, enclosure windows can comprisesilica-based materials, for example, but not limited by, such as glassand quartz, as well as various types of polymeric-based materials, forexample, but not limited by, such as various classes of polycarbonate,acrylic, and vinyl. One of ordinary skill in the art can understand thatvarious composites and combinations thereof of exemplary windowmaterials can also be useful as transparent and translucent materialsaccording to the present teachings.

As can be seen in FIG. 5 for frame member assembly 200,readily-removable service window panel 130 can have a gloveport with cap150. Though FIG. 3 is shown with all gloveports having gloves extendedoutwardly, as shown in FIG. 5, gloveports can also be capped dependingon whether or not an end-user requires remote access to the interior ofa gas enclosure assembly. Various embodiments of a capping assembly, asdepicted in FIGS. 6A-7B, provide for securely latching a cap over aglove when a glove, is not in use by an end-user, and at the same timeproviding for ready access when an end-user wishes to use a glove.

In FIG. 6A, cap 150 is shown, which can have interior surface 151,exterior surface 153 and side 152 that can be contoured for gripping.Extending from rim 154 of cap 150 are three shoulder screws 156. Asshown in FIG. 6B, each shoulder screw is set in rim 154, such that shank155 extends a set distance from rim 154, so that head 157 is not abuttedto rim 154. In FIG. 7A-7B, gloveport hardware assembly 160 can bemodified to provide a capping assembly that includes a locking mechanismfor capping a gloveport when the enclosure is pressurized to have apositive pressure relative to the enclosure exterior.

For various embodiments of gloveport hardware assembly 160 of FIG. 6A,bayonet clamping can provide closure of cap 150 over gloveport hardwareassembly 160, and at the same time provides a quick-coupling design forready access to a glove by an end-user. In the top expanded view ofgloveport hardware assembly 160 shown in FIG. 7A, gloveport assembly 160can comprise a back plate 161, and front plate 163, having a threadedscrew head 162 for mounting a glove and a flange 164. On flange 164 isshown bayonet latch 166 having slot 165 for receiving shoulder screwhead 157 of shoulder screw 156 (FIG. 6B). Each of a shoulder screw 156can be aligned and engage with each of a bayonet latch 166 of gloveporthardware assembly 160. Slot 168 of bayonet latch 166 has opening 165 atone end and locking recess 167 at the other end of slot 168. Once eachshoulder screw head 157 is inserted into each opening 165, cap 150 canbe rotated until shoulder screw head is abutted at the end of slot 168proximal to locking recess 167. The section view shown in FIG. 7Bdepicts a locking feature for capping a glove while a gas enclosureassembly system is in use. During use, the internal gas pressure of aninert gas in the enclosure is greater by a set amount than the pressureexterior a gas enclosure assembly. The positive pressure can fill thegloves (FIG. 3), so that when a glove is compressed under cap 150 duringuse of a gas enclosure assembly of the present teachings, shoulder screwhead 157 is moved into locking recess 167, ensuring that the gloveportwindow will be securely capped. However, an end-use can grip cap 150 byside 152 contoured for gripping, and easily disengage the cap secured inthe bayonet latch when not in use. FIG. 7B additionally shows back plate161 on interior surface 131 of window 134, as well as front plate 163 onexterior surface of window 134, both plates of which have O-ring seals169.

As will be discussed in the following teachings for FIGS. 8A-9B, walland ceiling frame member seals in conjunction with gas-tight sectionpanel frame seals together provide for various embodiments of anhermetically-sealed gas enclosure assembly for air-sensitive processesthat require an inert environment. Components of a gas enclosureassembly and system that contribute to providing substantially lowconcentrations of reactive species, as well as substantially lowparticulate environment can include, but are not limited by, anhermetically sealed gas enclosure assembly, as well as a highlyeffective gas circulation and particle filtration system, includingductwork. Providing effective hermetic seals for a gas enclosureassembly can be challenging; especially where three frame members cometogether to form a three-sided joint. As such, three-sided joint sealingpresents a particularly difficult challenge with respect to providingreadily-installable hermetic sealing for a gas enclosure assembly thatcan be assembled and disassembled through cycles of construction anddeconstruction

In that regard, various embodiments of a gas enclosure assemblyaccording to the present teachings provide for hermetic sealing of afully-constructed gas enclosure assembly and system through effectivegasket sealing of joints, as well as providing effective gasket sealingaround load bearing building components. Unlike conventional jointsealing, joint sealing according to the present teachings: 1) includesuniform parallel alignment of abutted gasket segments from orthogonallyoriented gasket lengths at top and bottom terminal frame joint junctureswhere three frame members are joined, thereby avoiding angular seamalignment and sealing, 2) provides for forming the abutted lengthsacross an entire width of a joint, thereby increasing the sealingcontact area at three-sided joint junctures, 3) is designed with spacerplates that provide uniform compression force across all vertical, andhorizontal, as well as top and bottom three-sided joint gasket seals.Additionally, the selection of the gasket material can impact theeffectiveness of providing an hermetic seal, which will be discussedsubsequently.

FIGS. 8A-8C are top schematic views that depict a comparison ofconventional three-sided joint seals to three-sided joint sealsaccording to the present teachings. According to various embodiments ofa gas enclosure assembly the present teachings, there can be, forexample, but not limited by, at least four wall frame members, a ceilingframe member and a pan, that can be joined to form a gas enclosureassembly, creating a plurality of vertical, horizontal, and three-sidedjoints requiring hermetic sealing. In FIG. 8A, a top schematic view of aconventional three-sided gasket seal formed from a first gasket I, whichis orthogonally oriented to gasket II in the X-Y plane. As shown in FIG.8A, a seam formed from the orthogonal orientation in the X-Y plane has acontact length W₁ between the two segments defined by the dimension ofwidth of the gasket. Additionally, a terminal end portion of gasket III,which is a gasket orthogonally oriented to both gasket I and gasket IIin the vertical direction, can abut gasket I and gasket II, as indicatedby the hatching. In FIG. 8B, a top schematic view of a conventionalthree-sided joint gasket seal formed from a first gasket length I, whichis orthogonal to a second gasket length II, and has a seam joining 45°faces of both lengths, where the seam has a contact length W₂ betweenthe two segments that is greater than the width of the gasket material.Similarly to the configuration of FIG. 8A, an end portion of gasket III,which is orthogonal to both gasket I and gasket II in the verticaldirection can abut gasket I and gasket II, as indicated by the hatching.Assuming that the gaskets widths are the same in FIG. 8A and FIG. 8B,the contact length W₂ for FIG. 8B is greater than the contact length W₁for FIG. 8A.

FIG. 8C is a top schematic view of a three-sided joint gasket sealaccording to the present teachings. A first gasket length I can have agasket segment I′ formed orthogonally to the direction of gasket lengthI, where gasket segment I′ has a length that can be approximately thedimension of the width of a structural component being joined, such as a4″ w×2″h or 4″ w×4″h metal tube used to form various wall frame membersof a gas enclosure assembly of the present teachings. Gasket II isorthogonal to gasket I in the X-Y plane, and has gasket segment II′,which has an overlapping length with gasket segment I′ that isapproximately the width of structural components being joined. The widthof gasket segments I′ and II′ are the width of a compressible gasketmaterial selected. Gasket III is orthogonally oriented to both gasket Iand gasket II in the vertical direction. Gasket segment III′ is an endportion of gasket III. Gasket segment III′ is formed from the orthogonalorientation of gasket segment III′ to the vertical length of gasket III.Gasket segment III′ can be formed so that it has approximately the samelength as gasket segments I′ and II′, and a width that is the thicknessof a compressible gasket material selected. In that regard, the contactlength W₃ for the three aligned segments shown in FIG. 8C is greaterthan for the conventional three-corner joint seals shown in either FIG.8A or FIG. 8B, having contact length W₁ and W₂, respectively.

In that regard, three-sided joint gasket sealing according to thepresent teachings creates uniform parallel alignment of gasket segmentsat terminal joint junctures from what would otherwise be orthogonallyaligned gaskets, as shown in the case of FIG. 8A and FIG. 8B. Suchuniform parallel alignment of the three-sided joint gasket sealingsegments provides for applying a uniform lateral sealing force acrossthe segments to promote an hermetic three-sided joint seal at the topand bottom corners of joints formed from wall frame members.Additionally, each segment of the uniformly aligned gasket segments foreach three-sided joint seal is selected to be approximately the width ofthe structural components being joined, providing for a maximum lengthof contact of the uniformly aligned segments. Moreover, joint sealingaccording to the present teachings is designed with spacer plates thatprovide a uniform compression force across all vertical, horizontal, andthree-sided gasket seals of a building joint. It may be argued that thewidth of the gasket material selected for conventional three-sided sealsgiven for the examples of FIGS. 8A and 8B could be at least the width ofstructural components being joined.

The exploded perspective view of FIG. 9A, depicts sealing assembly 300according to the present teachings before all frame members have beenjoined, so that the gaskets are depicted in an uncompressed state. InFIG. 9A, a plurality of wall frame members, such as wall frame 310, wallframe 350, as well as ceiling frame 370 can be sealably joined in afirst step of the construction of a gas enclosure from variouscomponents of a gas enclosure assembly. Frame member sealing accordingto the present teachings is a substantial part of providing that a gasenclosure assembly once fully constructed is hermetically sealed, aswell as providing sealing that can be implemented through cycles ofconstruction and deconstruction of a gas enclosure assembly. Though theexample given in the following teachings for FIGS. 9A-9B are for thesealing of a portion of a gas enclosure assembly, one of ordinary skillin the art will appreciate that such teachings apply to the entirety ofany of a gas enclosure assembly of the present teachings.

First wall frame 310 depicted in FIG. 9A can have interior side 311 onwhich spacer plate 312 is mounted, vertical side 314, and top surface315 on which spacer plate 316 is mounted. First wall frame 310 can havefirst gasket 320 disposed in and adhered to a space formed from spacerplate 312. Gap 302, remaining after first gasket 320 is disposed in andadhered to a space formed from spacer plate 312, can run a verticallength of first gasket 320, as shown in FIG. 9A. As depicted in FIG. 9A,compliant gasket 320 can be disposed in and adhered to the space formedfrom spacer plate 312, and can have vertical gasket length 321,curvilinear gasket length 323, and gasket length 325 that is formed 90°in plane to vertical gasket length 321 on interior frame member 311 andterminates at vertical side 314 of wall frame 310. In FIG. 9A, firstwall frame 310 can have top surface 315 on which spacer plate 316 ismounted, thereby forming a space on surface 315 on which second gasket340 is disposed in and adhered to proximal to inner edge 317 of wallframe 310. Gap 304, remaining after second gasket 340 is disposed in andadhered to a space formed from spacer plate 316, can run a horizontallength of second gasket 340, as shown in FIG. 9A. Further, as indicatedby the hatched line, length 345 of gasket 340 is uniformly parallel andcontiguously aligned with length 325 of gasket 320.

Second wall frame 350 depicted in FIG. 9A can have exterior frame side353, vertical side 354, and top surface 355 on which spacer plate 356 ismounted. Second wall frame 350 can have first gasket 360 disposed in andadhered to first gasket a space, which is formed from spacer plate 356.Gap 306, remaining after first gasket 360 is disposed in and adhered toa space formed from spacer plate 356, can run a horizontal length offirst gasket 360, as shown in FIG. 9A. As depicted in FIG. 9A, compliantgasket 360 can have horizontal length 361, curvilinear length 363, andlength 365 that is formed 90° in plane on top surface 355 and terminatesat exterior frame member 353.

As indicated in the exploded perspective view of FIG. 9A, interior framemember 311 of wall frame 310 can be joined to vertical side 354 of wallframe 350 to form one building joint of a gas enclosure frame assembly.Regarding the sealing of a building joint so formed, in variousembodiments of gasket sealing at terminal joint junctures of wall framemembers according to the present teachings as depicted in FIG. 9A,length 325 of gasket 320, length 365 of gasket 360 and length 345 ofgasket 340 are all contiguously and uniformly aligned. Additionally, aswill be discussed in more detail subsequently, various embodiments of aspacer plate of the present teachings can provide for a uniformcompression of between about 20% to about 40% deflection of acompressible gasket material used for hermetically sealing variousembodiments of a gas enclosure assembly of the present teachings.

FIG. 9B depicts sealing assembly 300 according to the present teachingsafter all frame members have been joined, so that the gaskets aredepicted in a compressed state. FIG. 9B is perspective view that showsthe detail of corner seal of a three-sided joint formed at the topterminal joint juncture between first wall frame 310, second wall frame350 and ceiling frame 370; which is shown in phantom view. As shown inFIG. 9B, the gasket spaces defined by the spacer plates can bedetermined to be a width, such that upon joining wall frame 310, wallframe 350 and ceiling frame 370; shown in phantom view, a uniformcompression of between about 20% to about 40% deflection of acompressible gasket material for forming vertical, horizontal, andthree-sided gasket seals ensures that gasket sealing at all surfacessealed at joints of wall frame members can provide hermetic sealing.Additionally gasket gaps 302, 304, and 306 (not shown) are dimensioned,so that upon optimal compression of between about 20% to about 40%deflection of a compressible gasket material, each gasket can fill agasket gap as shown for gasket 340 and gasket 360 in FIG. 9B. As such,in addition to providing uniform compression by defining a space inwhich each gasket is disposed in and adhered to, various embodiments ofa spacer plate designed to provide a gap also ensure that eachcompressed gasket can conform within the spaces defined by a spacerplate without wrinkling or bulging or otherwise irregularly forming in acompressed state in a fashion that could form leak paths.

According to various embodiments of a gas enclosure assembly of thepresent teachings, various types of section panels can be sealed usingcompressible gasket material disposed on each of a panel section frame.In conjunction with the frame member gasket sealing, the locations andmaterials of the compressible gaskets used to form seals between thevarious section panels and panel section frames can provide for anhermetically sealed gas enclosure assembly with little or no gasleakage. Additionally, the sealing design for all types of panels, suchas inset panel 110, window panel 120 and readily-removable servicewindow 130 of FIG. 5, can provide for durable panel sealing afterrepeated removal and installation of such panels that may be required asto access the interior of a gas enclosure assembly, for example, formaintenance.

For example, FIG. 10A, is an exploded view depicting service windowpanel section 30, and readily-removable service window 130. Aspreviously discussed, service window panel section 30 can be fabricatedfor receiving readily-removable service window 130. For variousembodiments of a gas enclosure assembly, a panel section, such asremovable service panel section 30, can have panel section frame 32, aswell as compressible gasket 38 disposed on panel section frame 32. Invarious embodiments, hardware related to fastening readily-removableservice window 130 in removable service window panel section 30 canprovide ease of installation and reinstallation to an end-user, and atthe same time ensure that a gas-tight seal is maintained whenreadily-removable service window 130 is installed and reinstalled inpanel section 30 as needed by an end-user requiring direct access to theinterior of a gas enclosure assembly. Readily-removable service window130 can include rigid window frame 132, which can be constructed from,for example, but not limited by, a metal tube material as described forconstructing any of the frame members of the present teachings. Servicewindow 130 can utilize quick-acting fastening hardware, for example, butnot limited by reverse acting toggle clamp 136 in order to provide anend-user ready removal and reinstallation of service window 130. Shownin FIG. 10A is the previously mentioned gloveport hardware assembly 160of FIGS. 7A-7B, showing a set of 3 bayonet latches 166.

As shown in front view of removable service window panel section 30 ofFIG. 10A, readily-removable service window 130 can have a set of fourtoggle clamps 136 secured on window frame 132. Service window 130 can bepositioned into panel section frame 30 at a defined distance forinsuring a proper compression force against gasket 38. Using a set offour window guide spacers 34, as shown in FIG. 10B, of which can beinstalled in each corner of panel section 30 for positioning servicewindow 130 in panel section 30. A set of each of a clamping cleat 36 canbe provided to receive reverse acting toggle clamp 136 of readilyremovable service window 136. According to various embodiments for thehermetic sealing of service window 130 through cycles of installationand removal, the combination of the mechanical strength of servicewindow frame 132, in conjunction with the defined position of servicewindow 130 provided by a set of window guide spacers 34 with respect tocompressible gasket 38 can ensure that once service window 130 issecured in place with, for example, but not limited by, using reverseaction toggle clamps 136 fastened in respective clamping cleats 36,service window frame 132 can provide an even force over panel sectionframe 32 with defined compression as set by a set of window guidespacers 34. The set of window guide spacers 34 are positioned so thatthe compression force of window 130 on gasket 38 deflects compressiblegasket 38 between about 20% to about 40%. In that regard, theconstruction of service window 130, as well as fabrication of panelsection 30 provide for a gas-tight seal of service window 130 in panelsection 30. As previously discussed, window clamps 35 can be installedinto panel section 30 after service window 130 is fastened into panelsection 30, and removed when service window 130 needs to be removed.

Reverse acting toggle clamp 136 can be secured to a readily-removableservice window frame 132 using any suitable means, as well as acombination of means. Examples of suitable securing means that can beused include at least one adhesive, for example, but not limited by anepoxy, or a cement, at least one bolt, at least one screw, at least oneother fastener, at least one slot, at least one track, at least oneweld, and a combination thereof. Reverse acting toggle clamp 136 can bedirectly connected to removable service window frame 132 or indirectlythrough an adaptor plate. Reverse acting toggle clamp 136, clampingcleat 36, window guide spacer 34, and window clamp 35 can be constructedof any suitable material, as well as a combination of materials. Forexample, one or more such elements can comprise at least one metal, atleast one ceramic, at least one plastic, and a combination thereof.

In addition to sealing a readily-removable service window, gas-tightsealing can also be provided for inset panels and window panels. Othertypes of section panels that can be repeatedly installed and removed inpanel sections include, for example, but not limited by, inset panels110 and window panels 120, as shown in FIG. 5. As can be seen in FIG. 5,panel frame 122 of window panel 120 is constructed similarly to insetpanel 110. As such, according to various embodiments of a gas enclosureassembly, the fabrication of panel sections for receiving inset panelsand window panels can be the same. In that regard, the sealing of insetpanels and window panel can be implemented using the same principles.

With reference to FIG. 11A and FIG. 11B, and according to variousembodiments of the present teachings, any of the panels of gasenclosure, such as gas enclosure assembly 100 of FIG. 1, can include oneor more inset panel sections 10, which can have frames 12 configured toreceive a respective inset panel 110. FIG. 11A is a perspective viewindicating an enlarged portion shown in FIG. 11B. In FIG. 11A insetpanel 110 is depicted positioned with respect to inset frame 12. As canbe seen in FIG. 11B, inset panel 110 is affixed to frame 12, where frame12 can be, for example, constructed of a metal. In some embodiments, themetal can comprise aluminum, steel, copper, stainless steel, chromium,an alloy, and combinations thereof, and the like. A plurality of a blindtapped hole 14 can be made in inset panel section frame 12. Panelsection frame 12 is constructed so as to comprise a gasket 16 betweeninset panel 110 and frame 12, in which compressible gasket 18 can bedisposed. Blind tapped hole 14 can be of the M5 variety. Screw 15 can bereceived by blind tapped hole 14, compressing gasket 16 between insetpanel 110 and frame 12. Once fastened into place against gasket 16,inset panel 110 forms a gas-tight seal within inset panel section 10. Aspreviously discussed, such panel sealing can be implemented for avariety of section panels, including, but not limited by, inset panels110 and window panels 120, as shown in FIG. 5.

According to various embodiments of compressible gaskets according tothe present teachings, compressible gasket material for frame membersealing and panel sealing can be selected from a variety of compressiblepolymeric materials, for example, but not limited by, any in the classof closed-cell polymeric materials, also referred to in the art asexpanded rubber materials or expanded polymer materials. Briefly, aclosed-cell polymer is prepared in a fashion whereby gas is enclosed indiscrete cells; where each discrete cell is enclosed by the polymericmaterial. Properties of compressible closed-cell polymeric gasketmaterials that are desirable for use in gas-tight sealing of frame andpanel components include, but are not limited by, that they are robustto chemical attack over a wide range of chemical species, possessexcellent moisture-barrier properties, are resilient over a broadtemperature range, and they are resistant to a permanent compressionset. In general, compared to open-cell-structured polymeric materials,closed-cell polymeric materials have higher dimensional stability, lowermoisture absorption coefficients, and higher strength. Various types ofpolymeric materials from which closed-cell polymeric materials can bemade include, for example, but not limited by, silicone, neoprene,ethylene-propylene-diene terpolymer (EPT); polymers and composites madeusing ethylene-propylene-diene-monomer (EPDM), vinyl nitrile,styrene-butadiene rubber (SBR), and various copolymers and blendsthereof.

The desirable material properties of closed-cell polymers are maintainedonly if the cells comprising the bulk material remain intact during use.In that regard, using such material in a fashion that can exceedmaterial specifications set for a closed-cell polymer, for example,exceeding the specification for use within a prescribed temperature orcompression range, may cause degradation of a gasket seal. In variousembodiments of closed-cell polymer gaskets used for sealing framemembers and section panels in frame panel sections, compression of suchmaterials should not exceed between about 50% to about 70% deflection,and for optimal performance can be between about 20% to about 40%deflection.

In addition to close-cell compressible gasket materials, another exampleof a class of compressible gasket material having desired attributes foruse in constructing embodiments of a gas enclosure assembly according tothe present teachings includes the class of hollow-extruded compressiblegasket materials. Hollow-extruded gasket materials as a class ofmaterials have the desirable attributes, including, but not limited by,that they are robust to chemical attack over a wide range of chemicalspecies, possess excellent moisture-barrier properties, are resilientover a broad temperature range, and they are resistant to a permanentcompression set. Such hollow-extruded compressible gasket materials cancome in a wide variety of form factors, such as for example, but notlimited by, U-cell, D-cell, square-cell, rectangular-cell, as well asany of a variety of custom form factor hollow-extruded gasket materials.Various hollow-extruded gasket materials can be fabricated frompolymeric materials that are used for closed-cell compressible gasketfabrication. For example, but not limited by, various embodiments ofhollow-extruded gaskets can be fabricated from silicone, neoprene,ethylene-propylene-diene terpolymer (EPT); polymers and composites madeusing ethylene-propylene-diene-monomer (EPDM), vinyl nitrile,styrene-butadiene rubber (SBR), and various copolymers and blendsthereof. Compression of such hollow cell gasket materials should notexceed about 50% deflection in order to maintain the desired attributes.

One of ordinary skill in the art can readily understand that while theclass of close-cell compressible gasket materials and the class ofhollow-extruded compressible gasket materials have been given asexamples, that any compressible gasket material having the desiredattributes can be used for sealing structural components, such asvarious wall and ceiling frame members, as well as sealing variouspanels in panel section frames, as provided by the present teachings.

The construction of a gas enclosure assembly, such as gas enclosureassembly 100 of FIG. 3 and FIG. 4, or as will be discussed subsequently,gas enclosure assembly 1000 of FIG. 23 and FIG. 24, from a plurality offrame members can be done to minimize the risk of damage systemcomponents such as, for example, but not limited by, gasket seals, framemembers, ducting, and section panels. Gasket seals, for example, arecomponents that can be prone to damage during construction of a gasenclosure from a plurality of frame members. In accordance with variousembodiments of the present teachings, materials and methods are providedfor minimizing or eliminating risks of damage to various components of agas enclosure assembly during construction of a gas enclosure accordingto the present teachings.

FIG. 12A is a perspective view of an initial phase of construction of agas enclosure assembly, such as gas enclosure assembly 100 of FIG. 3.Though a gas enclosure assembly, such as gas enclosures assembly 100 isused to exemplify construction of a gas enclosure assembly of thepresent teachings, one of ordinary skill can recognize that suchteachings apply to various embodiments of a gas enclosure assembly. Asdepicted in FIG. 12A, during an initial phase of construction of a gasenclosure assembly, a plurality of spacer blocks are first placed on pan204, which is supported by base 202. The spacer blocks can be thickerthan a compressible gasket material disposed on various wall framemembers that are mounted onto pan 204. A series of spacer blocks can beplaced on a peripheral edge of pan 204 at locations where the variouswall frame members of a gas enclosure assembly can be placed on a seriesof spacer blocks and into position proximal to pan 204 during assemblywithout contacting pan 204. It is desirable to assemble various wallframe members on pan 204 in a fashion that can protect any damage tocompressible gasket material disposed on various wall frame members forthe purpose of sealing with pan 204. Accordingly, the use of spacerblocks on which various wall panel components can be placed into aninitial position on pan 204 prevents such damage to a compressiblegasket material disposed on various wall frame members for the purposeof forming an hermetic seal with pan 204. For example, but not limitedby, as shown in FIG. 12A front peripheral edge 201 can have spacers 93,95 and 97 upon which a front wall frame member can rest, rightperipheral edge 205 can have spacers 89 and 91 upon which a right wallframe member can rest and back peripheral edge 207 can have two spacersupon which back wall frame spacer can rest, of which spacer 87 is shown.Any number, type, and combination of spacer blocks can be used. One ofordinary skill in the art will understand that the spacer blocks can bepositioned on pan 204 according to the present teachings, even thoughdistinct spacer blocks are not illustrated in each of FIG. 12A-FIG. 14B.

An exemplary spacer block according to various embodiments of thepresent teachings for the assembly of a gas enclosure from componentframe members is shown in FIG. 12B, which is a perspective view of thirdspacer block 91 shown in circled portion of FIG. 9A. Exemplary spacerblock 91 can include a spacer block strap 90 attached to a lateral side92 of the spacer block. The spacer blocks can be made of any suitablematerial, as well as a combination of materials. For example, eachspacer block can comprise ultrahigh molecular weight polyethylene.Spacer block strap 90 can be made of any suitable material, as well as acombination of materials. In some embodiments, spacer block strap 90comprises a nylon material, a polyalkylene material, or the like. Spacerblock 91 has a top surface 94 and a bottom surface 96. Spacer blocks 87,89, 93, 95, 97, and any other used can be configured in the same or asimilar physical attributes and can comprise the same or a similarmaterial. The spacer blocks can be rested, clamped or otherwise readilydisposed in a fashion that allows stable placement, yet ready removal toa peripheral upper edge of pan 204.

In the exploded perspective view rendered in FIG. 13, frame members cancomprise a front wall frame 210, a left wall frame 220, a right wallframe 230, a rear wall frame 240, and a ceiling or top frame 250, whichcan be attached to pan 204, which rests on base 202. An OLED printingsystem 50 can mounted on top of pan 204.

An OLED printing system 50 according to various embodiments of a gasenclosure assembly and system of the present teachings, can comprise,for example, a granite base, a moveable bridge that can support an OLEDprinting device, one or more devices and apparatuses running fromvarious embodiments of a pressurized inert gas recirculation system,such as a substrate floatation table, air bearings, tracks, rails, anink-jet printer system for depositing OLED film-forming material ontosubstrates, including an OLED ink supply subsystem and an inkjetprinthead, one or more robots, and the like. Given the variety ofcomponents that can comprise OLED printing system 50, variousembodiments of OLED printing system 50 can have a variety of footprintsand form factors.

AN OLED inkjet printing system can be comprised of several devices andapparatuses, which allow the reliable placement of ink drops ontospecific locations on a substrate. These devices and apparatuses caninclude, but are not limited to, a print head assembly, ink deliverysystem, motion system, substrate loading and unloading system, and printhead maintenance system. A print head assembly consists of at least oneink jet head, with at least one orifice capable of ejecting droplets ofink at a controlled rate, velocity, and size. The inkjet head is fed byan ink supply system which provides ink to the inkjet head. Printingrequires relative motion between the print head assembly and thesubstrate. This is accomplished with a motion system, typically a gantryor split axis XYZ system. Either the print head assembly can move over astationary substrate (gantry style), or both the print head andsubstrate can move, in the case of a split axis configuration. Inanother embodiment, the print station can be fixed, and the substratecan move in the X and Y axes relative to the print heads, with Z axismotion provided either at the substrate or the print head. As the printheads move relative to the substrate, droplets of ink are ejected at thecorrect time to be deposited in the desired location on the substrate.The substrate is inserted and removed from the printer using a substrateloading and unloading system. Depending on the printer configuration,this can be accomplished with a mechanical conveyor, a substratefloatation table, or a robot with end effector. A print head maintenancesystem can be comprised of several subsystems which allow for suchmaintenance tasks as drop volume calibration, wiping of the inkjetnozzle surface, priming for ejecting ink into a waste basin.

According to various embodiments of the present teachings for theassembly of a gas enclosure, front or first wall frame 210, left, orsecond wall frame 220, right or third wall frame 230, back or forth wallframe 250, and a ceiling frame 250 as shown in FIG. 13 may beconstructed together in a systematic order, and then attached to pan204, which is mounted upon base 202. Various embodiments of a framemember can be positioned on the spacer blocks in order to prevent damageto compressible gasket material, as previously discussed, using a gantrycrane. For example, using a gantry crane, front wall frame 210 can berested on at least three spacer blocks, such as spacer blocks 93, 95 and97 on peripheral upper edge 201 of pan 204 as shown in FIG. 12A.Following the placement of front wall frame 210 on spacer blocks, wallframe 220 and wall frame 230 may be placed, successively or sequentiallyin any order, on spacer blocks that have been set on peripheral edge 203and peripheral edge 205, respectively of pan 204. According to variousembodiments of the present teachings for the assembly of a gas enclosurefrom component frame members, front wall frame 210 can be placed onspacer blocks, followed by the placement of left wall frame 220 andright wall frame 230 on spacer blocks, so that they are in position tobe bolted or otherwise fastened to front wall frame 210. In variousembodiments, rear wall frame 240 can be placed on spacer blocks, so thatit is in position to be bolted or fastened to left wall frame 220 andright wall frame 230. For various embodiments, once wall frame membershave been secured together to form a contiguous wall frame enclosureassembly, top ceiling frame 250 can be affixed to such a wall frameenclosure assembly to form a complete gas enclosure frame assembly. Invarious embodiments of the present teachings for the construction of agas enclosure assembly, a complete gas enclosure frame assembly at thisstage of assembly is resting on the plurality of spacer blocks in orderto protect the integrity of various frame member gaskets.

As shown in FIG. 14A, for various embodiments of the present teachingsfor the construction of a gas enclosure assembly, gas enclosure frameassembly 400 can then be positioned so that spacers can be removed inpreparation for attaching gas enclosure frame assembly 400 to pan 204.FIG. 14A depicts gas enclosure frame assembly 400 raised to a positionelevated from and off of the spacer blocks using lifter assembly 402,lifter assembly 404, and lifter assembly 406. In various embodiments ofthe present teachings, lifter assemblies 402, 404, and 406 can beattached around the perimeter of gas enclosure frame assembly 400. Afterthe lifter assemblies are attached, a fully-constructed gas enclosureframe assembly can be lifted off of the spacer blocks by actuating eachlifter assembly to elevate or extend each of the lifter assemblies,thereby elevating gas enclosure frame assembly 400. As shown in FIG.14A, gas enclosure frame assembly 400 is shown lifted above theplurality of spacer blocks on which it had previously rested. Theplurality of spacer blocks can then be removed from their restingpositions on pan 204 so that the frame can then be lowered onto pan 204,and then attached to pan 204.

FIG. 14B is an exploded view of a same lifter assembly 402, according tovarious embodiments of a lifter assembly of the present teachings, andas depicted in FIG. 11A. As shown, lifter assembly 402 includes a scuffpad 408, a mount plate 410, a first clamp mount 412, and a second clampmount 413. A first clamp 414 and a second clamp 415 are shown in linewith respective clamp mounts 412 and 413. A jack crank 416 is attachedto the top of a jack shaft 418. A trailer jack 520 is shownperpendicular and attached to jack shaft 418. A jack base 422 is shownas part of the lower end of jack shaft 418. Below jack base 422 is afoot mount 424 that is configured to receive and be connectable to thelower end of jack shaft 418. Leveling foot 426 is also shown and isconfigured to be received by foot mount 424. One of ordinary skill inthe art can readily recognize that any means suitable for a liftingoperation can be used to raise a gas enclosure frame assembly from thespacer blocks so that the spacer blocks can be removed and an intact gasenclosure assembly can be lowered onto a pan. For example, instead ofone or more lifter assemblies such as 402, 404, and 406 described above,hydraulic, pneumatic, or electric lifters can be used.

According to various embodiments of the present teachings for theconstruction of a gas enclosure assembly, a plurality of fasteners canbe provided and configured to fasten the plurality of frame memberstogether, and then fasten a gas enclosure frame assembly to a pan. Theplurality of fasteners can include one or more fastener parts disposedalong each edge of each frame member at a location where the respectiveframe member is configured to intersect with an adjacent frame member ofa plurality of frame members. The plurality of fasteners and thecompressible gaskets can be configured such that, when the frame membersare joined together, the compressible gaskets are disposed proximal theinterior and the hardware is proximal the exterior in order that thehardware does not provide a plurality of leak paths for a gas-tightenclosure assembly of the present teachings.

The plurality of fasteners can comprise a plurality of bolts along theedge of one or more of the frame members, and the plurality of threadedholes along the edge of one or more different frame members of aplurality of frame members. The plurality of fasteners can comprise aplurality of captured bolts. The bolts can comprise bolt heads extendingaway from an outer surface of the respective panel. The bolts can besunken into recesses in a frame member. Clamps, screws, rivets,adhesives, and other fasteners can be used to secure the frame memberstogether. The bolts or other fasteners can extend through the outer wallof one or more of the frame members and into threaded holes or othercomplementary fastener features in a side wall or top wall of one ormore adjacent frame members.

As depicted in FIGS. 15-17, for various embodiments of a method for theconstruction of a gas enclosure, ductwork can be installed in aninterior portion formed by the joining of wall frame and ceiling framemembers. For various embodiments of a gas enclosure assembly, ductworkmay be installed during the construction process. According to variousembodiments of the present teachings, ductwork may be installed within agas enclosure frame assembly, which has been constructed from aplurality of frame members. In various embodiments, ductwork can beinstalled on a plurality of frame members before they are joined to forma gas enclosure frame assembly. Ductwork for various embodiments of agas enclosure assembly and system can be configured such thatsubstantially all gas drawn into the ductwork from one or more ductworkinlets is moved through various embodiments of a gas circulation andfiltration loop for removing particulate matter internal a gas enclosureassembly. Additionally, ductwork of various embodiments of a gasenclosure assembly and system can be configured to separate the inletsand outlets of a gas purification loop external to a gas enclosureassembly from the gas circulation and filtration loop for removingparticulate matter internal to a gas enclosure assembly. Variousembodiments of ductwork in accordance with the present teachings can befabricated from metal sheet, for example, but not limited by, aluminumsheet having a thickness of about 80 mil.

FIG. 15 depicts a right front phantom perspective view of ductworkassembly 500 of gas enclosure assembly 100. Enclosure ductwork assembly500 can have front wall panel ductwork assembly 510. As shown front wallpanel ductwork assembly 510 can have front wall panel inlet duct 512,first front wall panel riser 514 and second front wall panel riser 516,both of which are in fluid communication with front wall panel inletduct 512. First front wall panel riser 514 is shown having outlet 515,which is sealably engaged with ceiling duct 505 of fan filter unit cover103. In a similar fashion, second front wall panel riser 516 is shownhaving outlet 517, which is sealably engaged with ceiling duct 507 offan filter unit cover 103. In that regard, front wall panel ductworkassembly 510 provides for circulating inert gas with a gas enclosureassembly from the bottom, utilizing front wall panel inlet duct 512,through each front wall panel riser, 514 and 516, and delivering the airthrough outlets 505 and 507, respectively, so that the air can befiltered by, for example, fan filter unit 752. As will be discussed inmore detail subsequently, the number, size and shape of fan filter unitscan be selected in accordance with the physical position of a substratein a printing system during processing. Proximal fan filter unit 752 isheat exchanger 742, which as part of a thermal regulation system, canmaintain inert gas circulating through gas enclosure assembly 100 at adesired temperature.

Right wall panel ductwork assembly 530 can have right wall panel inletduct 532, which is in fluid communication with right wall panel upperduct 538 through right wall panel first riser 534 and right wall panelsecond riser 536. Right wall panel upper duct 538, can have first ductinlet end 535 and second duct outlet end 537, which second duct outletend 537 is in fluid communication with rear wall panel upper duct 536 ofrear wall ductwork assembly 540. Left wall panel ductwork assembly 520can have the same components as described for right wall panel assembly530, of which left wall panel inlet duct 522, which is in fluidcommunication with left wall panel upper duct (not shown) through firstleft wall panel riser 524 and first left wall panel riser 524 areapparent in FIG. 15. Rear wall panel ductwork assembly 540 can have rearwall panel inlet duct 542, which is in fluid communication with leftwall panel assembly 520 and right wall panel assembly 530. Additionally,rear wall panel ductwork assembly 540, can have rear wall panel bottomduct 544, which can have rear wall panel first inlet 541 and rear wallpanel second inlet 543. Rear wall panel bottom duct 544 can be in fluidcommunication with rear wall panel upper duct 536 via first bulkhead 547and second bulkhead 549, which bulkhead structures can be used to feed,for example, but not limited by, various bundles of cables, wires, andtubings and the like, from the exterior of gas enclosure assembly 100into the interior. Duct opening 533 provides for moving bundles ofcables, wires, and tubings and the like, out of rear wall panel upperduct 536, which can be passed through upper duct 536 via bulkhead 549.Bulkhead 547 and bulkhead 549 can be hermetically sealed on the exteriorusing a removable inset panel, as previously described. Rear wall panelupper duct is in fluid communication with, for example, but not limitedby, fan filter unit 754 through vent 545, of which a corner is shown inFIG. 15. In that regard, left wall panel ductwork assembly 520, rightwall panel ductwork assembly 530, and rear wall panel ductwork assembly540 provide for circulating inert gas within a gas enclosure assemblyfrom the bottom, utilizing wall panel inlet ducts 522, 532, and 542,respectively, as well as rear panel lower duct 544, which are in fluidcommunication with vent 545 through various risers, ducts, bulkheadpassages, and the like as previously described, so that the air can befiltered by, for example, fan filter unit 754. Proximal fan filter unit754 is heat exchanger 744, which as part of a thermal regulation system,can maintain inert gas circulating through gas enclosure assembly 100 ata desired temperature.

In FIG. 15, cable feed through opening 533 is shown. As will bediscussed in more detail subsequently, various embodiments of a gasenclosure assembly of the present teachings provide for bringing bundlesof cables, wires, and tubings and the like through ductwork. In order toeliminate leak paths formed around such bundles, various approaches forsealing differently sized cables, wires, and tubings in a bundle usingconforming material can be used. Also shown in FIG. 15 for enclosureductwork assembly 500 is conduit I and conduit II, which are shown aspart of fan filter unit cover 103. Conduit 1 provides an outlet of inertgas to an external gas purification system, while conduit II provides areturn of purified inert gas to the gas circulation and particlefiltration loop internal gas enclosure assembly 100.

In FIG. 16, a top phantom perspective view of enclosure ductworkassembly 500 is shown. The symmetric nature of left wall panel ductworkassembly 520 and right wall panel ductwork assembly 530 can be seen. Forright wall panel ductwork assembly 530, right wall panel inlet duct 532,is in fluid communication with right wall panel upper duct 538 throughright wall panel first riser 534 and right wall panel second riser 536.Right wall panel upper duct 538, can have first duct inlet end 535 andsecond duct outlet end 537, which second duct outlet end 537 is in fluidcommunication with rear wall panel upper duct 536 of rear wall ductworkassembly 540. Similarly, left wall panel ductwork assembly 520 can haveleft wall panel inlet duct 522, which is in fluid communication withleft wall panel upper duct 528 through left wall panel first riser 524and left wall panel second riser 526. Left wall panel upper duct 528,can have first duct inlet end 525 and second duct outlet end 527, whichsecond duct outlet end 527 is in fluid communication with rear wallpanel upper duct 536 of rear wall ductwork assembly 540. Additionally,rear wall panel ductwork assembly can have rear wall panel inlet duct542, which is in fluid communication with left wall panel assembly 520and right wall panel assembly 530. Additionally, rear wall panelductwork assembly 540, can have rear wall panel bottom duct 544, whichcan have rear wall panel first inlet 541 and rear wall panel secondinlet 543. Rear wall panel bottom duct 544 can be in fluid communicationwith rear wall panel upper duct 536 via first bulkhead 547 and secondbulkhead 549. Ductwork assembly 500 as shown in FIG. 15 and FIG. 16 canprovide effective circulation of inert gas from front wall panelductwork assembly 510, which circulates inert gas from front wall panelinlet duct 512 to ceiling panel ducts 505 and 507 via front wall paneloutlets 515 and 517, respectively, as well as from left wall panelassembly 520, right wall panel assembly 530 and rear wall panel ductworkassembly 540, which circulate air from inlet ducts 522, 532, and 542,respectively to vent 545. Once inert gas is exhausted via ceiling panelducts 505 and 507 and vent 545 into the enclosure area under fan filterunit cover 103 of enclosure 100, the inert gas so exhausted can befiltered through fan filter units 752 and 754. Additionally, thecirculated inert gas can be maintained at a desired temperature by heatexchangers 742 and 744, which are part of a thermal regulation system.

FIG. 17 is a bottom phantom view of enclosure ductwork assembly 500.Inlet ductwork assembly 502 includes front wall panel inlet duct 512,left wall panel inlet duct 522, right wall panel inlet duct 532, andrear wall panel inlet duct 542, which are in fluid communication withone another. For each inlet duct included in inlet ductwork assembly502, there are apparent openings evenly distributed across the bottom ofeach duct, sets of which are specifically highlighted for the purpose ofthe present teachings, as openings 511 of front wall panel inlet duct512, openings 521 of left wall panel inlet duct 522, openings 531 ofright wall panel inlet duct 532, and openings 541 of right wall panelinlet duct 542. Such openings, as are apparent across the bottom of eachinlet duct, provide for effective uptake of inert gas within enclosure100 for continual circulation and filtration. The continual circulationand filtration of inert gas various embodiments of a gas enclosureassembly provide for maintaining a substantially particle-freeenvironment within various embodiments of a gas enclosure assemblysystem. Various embodiments of a gas enclosure assembly system can bemaintained at ISO 14644 Class 4 for particulate matter. Variousembodiments of a gas enclosure assembly system can be maintained at ISO14644 Class 3 specifications for processes that are particularlysensitive to particle contamination. As previously discussed, conduit Iprovides an outlet of inert gas to an external gas purification system,while conduit II provides a return of purified inert gas to thefiltration and circulation loop internal to gas enclosure assembly 100.

In various embodiments of a gas enclosure assembly and system accordingto the present teachings, bundles of cables, wires, and tubings and thelike, can be operatively associated with an electrical system, amechanical system, a fluidic system, and a cooling system disposedwithin the interior of a gas enclosure assembly and system, for example,for the operation of an OLED printing system. Such bundles can be fedthrough ducting in order to purge reactive atmospheric gases, such aswater vapor and oxygen, which are occluded in dead spaces of bundles ofcables, wires, and tubings and the like. Dead spaces formed withinbundles of cables, wires, and tubings have been found, according to thepresent teachings, to create reservoirs of occluded reactive speciesthat can significantly prolong the time it can take to bring a gasenclosure assembly within the specifications for performing anair-sensitive process. For various embodiments of a gas enclosureassembly and system of the present teachings useful for printing OLEDdevices, each species of various reactive species, including variousreactive atmospheric gases, such as water vapor and oxygen, as well asorganic solvent vapors can be maintained at 100 ppm or lower, forexample, at 10 ppm or lower, at 1.0 ppm or lower, or at 0.1 ppm orlower.

To understand how cabling fed through ducting can result in decreasingthe time it takes to purge occluded reactive atmospheric gases from deadvolumes in bundled cables, wires, and tubings and the like, reference ismade to FIGS. 18A-19. FIG. 18A depicts an expanded view of bundle I,which can be a bundle that can include tubing, such as tubing A fordelivering various inks, solvents and the like, to a printing system,such as printing system 50 of FIG. 13. Bundle 1 of FIG. 18A canadditionally include electrical wiring, such as electrical wire B orcabling, such as coaxial cable C. Such tubings, wires and cables can bebundled together and routed from the exterior to the interior to beconnected to various devices and apparatuses comprising an OLED printingsystem. As seen in the hatched area of FIG. 18A, such bundles can createan appreciable dead space D. In the schematic perspective view of FIG.18B, when cable, wire, and tubing bundle I is fed through duct II, inertgas III can continuously sweep past the bundle. The expanded sectionview of FIG. 19 depicts how effectively inert gas continuously sweepingpast bundled tubings, wires and cables can increase the rate of removalof occluded reactive species from dead volume formed in such bundles.The rate of diffusion of a reactive species A out of a dead volume,indicated in FIG. 19 by the collective area occupied by species A, isinversely proportional to the concentration of the reactive speciesoutside of the dead volume, indicated in FIG. 19 by the collective areaoccupied by inert gas species B. That is, if the concentration of areactive species is high in a volume just outside the dead volume, thenthe rate of diffusion is decreased. If a reactive species concentrationin such an area is continuously decreased from the volume just outsidedead volume space by a flow stream of inert gas, then by mass action,the rate at which the reactive species diffuses from the dead volume isincreased. Additionally, by the same principle, inert gas can diffuseinto the dead volume as occluded reactive species are effectivelyremoved out of those spaces.

FIG. 20A is a perspective view of a rear corner of various embodimentsof gas enclosure assembly 600, with a phantom view through return duct605 into the interior of gas enclosure assembly 600. For variousembodiments of gas enclosure assembly 600, rear wall panel 640 can haveinset panel 610, which is configured to provide access to, for example,an electrical bulkhead. A bundle of cables, wires, and tubings and thelike can be fed through a bulkhead into a cable routing duct, such asduct 632 shown in right wall panel 630, for which a removable insetpanel has been removed to reveal a bundle routed into a first cable,wire, and tubing bundle duct entry 636. From there, the bundle can befed into the interior of gas enclosure assembly 600, and is shown in thephantom view through return duct 605 in the interior of gas enclosureassembly 600. Various embodiments of a gas enclosure assembly for cable,wire, and tubing bundle routing can have more than one cable, wire, andtubing bundle entry, such as shown in FIG. 20A, which depicts a firstbundle duct entry 634 and a second bundle duct entry 636, for stillanother bundle. FIG. 20B depicts an expanded view of bundle duct entry634 for a cable, wire, and tubing bundle. Bundle duct entry 634 can haveopening 631, which is designed to form a seal with sliding cover 633. Invarious embodiments, opening 631 can accommodate a flexible sealingmodule, such as those provided by Roxtec Company for cable entry seals,which can accommodate various diameters of cable, wire, and tubing andthe like in a bundle. Alternatively, top 635 of sliding cover 633 andupper portion 637 of opening 631 may have a conforming material disposedon each surface, so that the conforming material can form a seal aroundvarious-sized diameters of cable, wire, and tubing and the like in abundle fed through an entry, such as bundle duct entry 634.

FIG. 21 is a bottom view of various embodiments of a ceiling panel ofthe present teaching, for example, such as ceiling panel 250′ of gasenclosure assembly and system 100 of FIG. 3. According to variousembodiments of the present teachings for the assembly of a gasenclosure, lighting can be installed on the interior top surface of aceiling panel, such as ceiling panel 250′ of gas enclosure assembly andsystem 100 of FIG. 3. As depicted in FIG. 21, ceiling frame 250, havinginterior portion 251, can have lighting installed on the interiorportion of various frame members. For example, ceiling frame 250 canhave two ceiling frame sections 40, which have in common two ceilingframe beams 42 and 44. Each ceiling frame section 40 can have a firstside 41, positioned towards the interior of ceiling frame 250, and asecond side 43, positioned towards the exterior of ceiling frame 250.For various embodiments according to the present teaching of providinglighting for a gas enclosure, pairs of lighting elements 46 can beinstalled. Each pair of lighting elements 46 can include a firstlighting element 45, proximal to first side 41 and second lightingelement 47 proximal to second side 43 of a ceiling frame section 40. Thenumber, positioning, and grouping of lighting elements shown in FIG. 21are exemplary. The number and grouping of lighting elements can bevaried in any desired or suitable manner. In various embodiments, thelighting elements can be mounted flat, while in other embodiments thatcan be mounted so that they can be moved to a variety of positions andangles. The placement of lighting elements is not limited to the toppanel ceiling 433 but can located, in addition or in the alternative, onany other interior surface, exterior surface, and combination ofsurfaces of gas enclosure assembly and system 100 shown in FIG. 3.

The various lighting elements can comprise any number, type, orcombination of lights, for example, halogen lights, white lights,incandescent lights, arc lamps, or light emitting diodes or devices(LEDs). For example, each lighting element can comprise from 1 LED toabout 100 LEDs, from about 10 LEDs to about 50 LEDs, or greater than 100LEDs. LED or other lighting devices can emit any color or combination ofcolors in the color spectrum, outside the color spectrum, or acombination thereof. According to various embodiments of a gas enclosureassembly used for inkjet printing of OLED materials, as some materialsare sensitive to some wavelengths of light, a wavelength of light forlighting devices installed in a gas enclosure assembly can bespecifically selected to avoid material degradation during processing.For example, a 4× cool white LED can be used as can a 4× yellow LED orany combination thereof. An example of a 4× cool white LED is anLF1B-D4S-2THWW4 available from IDEC Corporation of Sunnyvale, Calif. Anexample of a 4× yellow LED that can be used is an LF1B-D4S-2SHY6 alsoavailable from IDEC Corporation. LEDs or other lighting elements can bepositioned or hung from any position on interior portion 251 of ceilingframe 250 or on another surface of a gas enclosure assembly. Lightingelements are not limited to LEDs. Any suitable lighting element orcombination of lighting elements can be used. FIG. 22 is a graph of anIDEC LED light spectra and shows the x-axis corresponding to intensitywhen peak intensity is 100% and the y-axis corresponding to wavelengthin nanometers. Spectra for LF1B yellow type, a yellow fluorescent lamp,a LF1B white type LED, a LF1B cool white type LED, and an LF1B red typeLED are shown. Other light spectra and combinations of light spectra canbe used in accordance with various embodiments of the present teachings.

Recalling, various embodiments of a gas enclosure assembly beconstructed in a fashion minimizes the internal volume of a gasenclosure assembly, and at the same time optimizes the working space toaccommodate various footprints of various OLED printing systems. Variousembodiments of a gas enclosure assembly so constructed additionallyprovide ready access to the interior of a gas enclosure assembly fromthe exterior during processing and readily access to the interior formaintenance, while minimizing downtime. In that regard, variousembodiments of a gas enclosure assembly according to the presentteachings can be contoured with respect to various footprints of variousOLED printing systems.

One of ordinary skill may appreciate that the present teachings forframe member construction, panel construction, frame and panel sealing,as well as construction of a gas enclosure assembly, such as gasenclosure assembly 100 of FIG. 3, can be applied to a gas enclosureassembly of a variety of sizes and designs. For example, but not limitedby, various embodiments of a contoured gas enclosure assembly of thepresent teachings covering substrate sizes from Gen 3.5 to Gen 10 canhave an internal volume of between about 6 m³ to about 95 m³, which canbe between about 30% to about 70% savings in volume for an enclosure notcontoured and having comparative gross dimensions. Various embodimentsof a gas enclosure assembly can have various frame members that areconstructed to provide contour for a gas enclosure assembly, in order toaccommodate an OLED printing system for its function and at the sametime optimize the working space to minimize inert gas volume, and alsoallow ready access to an OLED printing system from the exterior duringprocessing. In that regard, various gas enclosure assemblies of thepresent teachings can vary in contoured topology and volume.

FIG. 23 provides an example of a gas enclosure assembly according to thepresent teachings. Gas enclosure assembly 1000 can include front frameassembly 1100, middle frame assembly 1200, and back frame assembly 1300.Front frame assembly 1100 can include front frame base 1120, front wallframe 1140, which has opening 1142 for receiving a substrate, and frontceiling frame 1160. Middle frame assembly 1200 can include middle framebase 1220, right end wall frame 1240, middle wall frame 1260 and leftend wall frame 1280. Rear frame assembly 1300 can include rear framebase 1320, rear wall frame 1340, and rear ceiling frame 1360. The areasshown in hatching depict the available working volume of gas enclosureassembly 1000, which is the volume that is available to accommodate anOLED printing system. Various embodiments of gas enclosure assembly 1000are contoured so as to minimize the volume of recirculated inert gasrequired to operate an air-sensitive process, such as an OLED printingprocess, and at the same time allow ready access to an OLED printingsystem; either remotely during operation or directly by easy accessthrough readily-removable panels. Various embodiments of a contoured gasenclosure assembly according to the present teachings can have a gasenclosure volume of between about 6 m³ to about 95 m³ for variousembodiments of a gas enclosure assembly of the present teachingscovering substrate sizes from Gen 3.5 to Gen 10 m, and of for example,but not limited by, of between about 15 m³ to about 30 m³, which mightbe useful for OLED printing of, for example, Gen 5.5 to Gen 8.5substrate sizes.

Gas enclosure assembly 1000 can have all the features recited in thepresent teachings for exemplary gas enclosure assembly 100. For example,but not limited by, gas enclosure assembly 1000 can utilize the sealingaccording to the present teachings that provide an hermetic-sealedenclosure through cycles of construction and deconstruction. Variousembodiments of a gas enclosure system based on gas enclosure assembly1000 can have a gas purification system that can maintain levels foreach species of various reactive species, including various reactiveatmospheric gases, such as water vapor and oxygen, as well as organicsolvent vapors at 100 ppm or lower, for example, at 10 ppm or lower, at1.0 ppm or lower, or at 0.1 ppm or lower.

Further, various embodiments of a gas enclosure assembly system based ongas enclosure assembly 1000 can have a circulation and filtration systemthat can provide a particle-free environment meeting ISO 14644 Class 3and Class 4 clean room standards. Additionally, as will be discussed inmore detail subsequently, a gas enclosure assembly system based on a gasenclosure assembly of the present teachings, such as gas enclosureassembly 100 and gas enclosure assembly 1000, can have a variousembodiments of a pressurized inert gas recirculation system, which canbe used to operate, for example, but not limited by, one or more of apneumatic robot, a substrate floatation table, an air bearing, an airbushing, a compressed gas tool, a pneumatic actuator, and combinationsthereof. For various embodiments of a gas enclosure and system of thepresent teachings, the use of various pneumatically operated devices andapparatuses can be provide low-particle generating performance, as wellas being low maintenance.

FIG. 24 is an exploded view of gas enclosure assembly 1000, depictingvarious frame members that can be constructed to provide for anhermetically-sealed gas enclosure, according to the present teachings.As previously discussed for various embodiments of gas enclosure 100 ofFIG. 3 and FIG. 13, OLED inkjet printing system 50 can be comprised ofseveral devices and apparatuses, which allow the reliable placement ofink drops onto specific locations on a substrate, such as substrate 60,shown proximal to substrate floatation table 54. Given the variety ofcomponents that can comprise OLED printing system 50, variousembodiments of OLED printing system 50 can have a variety of footprintsand form factors. According to various embodiments of an OLED inkjetprinting system, a variety of substrate materials can be used forsubstrate 60, for example, but not limited by, a variety of glasssubstrate materials, as well as a variety of polymeric substratematerials.

According to various embodiments of a gas enclosure assembly of thepresent teachings, as previously described for gas enclosure assembly100, construction of a gas enclosure assembly can be done around theentirety of an OLED printing system to minimize the volume of a gasenclosure assembly, as well as providing ready access to the interior.In FIG. 24, an example of contouring can be given in consideration OLEDprinting system 50.

As shown in FIG. 24, there can be six isolators on OLED printing system50, two of which can be seen first isolator 51 and second isolator 53,which support substrate floatation table 54 of OLED printing system 50.In addition to two additional isolators each opposite seen firstisolator 51 and second isolator 53, there are two isolators supportingOLED printing system base 52. Front enclosure base 1120 can have firstfront enclosure isolator mount 1121, which supports first frontenclosure isolator wall frame 1123. Second front enclosure isolator wallframe 1127 is supported by second front enclosure an isolator mount (notshown). Similarly, middle enclosure base 1220 can have first middleenclosure isolator mount 1221, which supports first middle enclosureisolator wall frame 1223. Second middle enclosure isolator wall frame1127 is supported by second middle enclosure an isolator mount (notshown). Finally, rear enclosure base 1320 can have first rear enclosureisolator mount 1321, which supports rear middle enclosure isolator wallframe 1323. Second rear enclosure isolator wall frame 1127 is supportedby second rear enclosure an isolator mount (not shown). Variousembodiments of isolator wall frame members have been contoured aroundeach isolator, thereby minimizing the volume around each isolatorsupport member. Additionally, the shaded panel sections shown for eachisolator wall frame for base 1120, 1220, and 1320 are removable panelsthat can be removed, for example, to service an isolator. Frontenclosure assembly base 1120 can have pan 1122, while middle enclosureassembly base 1220 can have pan 1222, and rear enclosure assembly base1320 can have pan 1322. When the bases are fully-constructed to form acontiguous base, an OLED printing system can be mounted on a contiguouspan formed thereby, in a similar fashion to the mounting of OLEDprinting system 50 on pan 204 of FIG. 13. As previously described, walland ceiling frame members, such as wall frame 1140, ceiling frame 1160,of front frame assembly 1100, and wall frames 1240, 1260 and 1280 ofmiddle frame assembly 1200, as well as wall frame 1340, ceiling frame1360, of rear frame assembly 1300, can then be joined around OLEDprinting system 50. As such, various embodiments of hermetically-sealedcontoured wall frame members of the present teachings effectivelydecrease the volume of inert gas in gas enclosure assembly 1000, whileat the same time providing ready access to various devices andapparatuses of an OLED printing system.

A gas enclosure assembly and system according to the present teachingscan have a gas circulation and filtration system internal a gasenclosure assembly. Such an internal filtration system can have aplurality of fan filter units within the interior, and can be configuredto provide a laminar flow of gas within the interior. The laminar flowcan be in a direction from a top of the interior to a bottom of theinterior, or in any other direction. Although a flow of gas generated bya circulating system need not be laminar, a laminar flow of gas can beused to ensure thorough and complete turnover of gas in the interior. Alaminar flow of gas can also be used to minimize turbulence, suchturbulence being undesirable as it can cause particles in theenvironment to collect in such areas of turbulence, preventing thefiltration system from removing those particles from the environment.Further, to maintain a desired temperature in the interior, a thermalregulation system utilizing a plurality of heat exchangers can beprovided, for example, operating with, adjacent to, or used inconjunction with, a fan or another gas circulating device. A gaspurification loop can be configured to circulate gas from within theinterior of a gas enclosure assembly through at least one gaspurification component exterior the enclosure. In that regard, afiltration and circulation system internal a gas enclosure assembly inconjunction with a gas purification loop external a gas enclosureassembly can provide continuous circulation of a substantiallylow-particulate inert gas having substantially low levels of reactivespecies throughout a gas enclosure assembly. The gas purification systemcan be configured to maintain very low levels of undesired components,for example, organic solvents and vapors thereof, as well as water,water vapor, oxygen, and the like.

FIG. 25 is a schematic diagram showing a gas enclosure assembly andsystem 2100. Various embodiments of a gas enclosure assembly and system2100 can comprise a gas enclosure assembly 1500 according to the presentteachings, a gas purification loop 2130 in fluid communication gasenclosure assembly 1500, and at least one thermal regulation system2140. Additionally, various embodiments of a gas enclosure assembly andsystem can have pressurized inert gas recirculation system 2169, whichcan supply inert gas for operating various devices, such as a substratefloatation table for an OLED printing system. Various embodiments of apressurized inert gas recirculation system 2169 can utilize acompressor, a blower and combinations of the two as sources for variousembodiments of inert gas recirculation system 2169, as will be discussedin more detail subsequently. Additionally, gas enclosure assembly andsystem 2100 can have a filtration and circulation system internal to gasenclosure assembly and system 2100 (not shown).

As depicted in FIG. 25, for various embodiments of a gas enclosureassembly according to the present teachings, the design of the ductingcan separate the inert gas circulated through gas purification loop 2130from the inert gas that is continuously filtered and circulatedinternally for various embodiments of a gas enclosure assembly. Gaspurification loop 2130 includes outlet line 2131 from gas enclosureassembly 1500, to a solvent removal component 2132 and then to gaspurification system 2134. Inert gas purified of solvent and otherreactive gas species, such as oxygen and water vapor, are then returnedto gas enclosure assembly 1500 through inlet line 2133. Gas purificationloop 2130 may also include appropriate conduits and connections, andsensors, for example, oxygen, water vapor and solvent vapor sensors. Agas circulating unit, such as a fan, blower or motor and the like, canbe separately provided or integrated, for example, in gas purificationsystem 2134, to circulate gas through gas purification loop 2130.According to various embodiments of a gas enclosure assembly, thoughsolvent removal system 2132 and gas purification system 2134 are shownas separate units in the schematic shown in FIG. 25, solvent removalsystem 2132 and gas purification system 2134 can be housed together as asingle purification unit. Thermal regulation system 2140 can include atleast one chiller 2141, which can have fluid outlet line 2143 forcirculating a coolant into a gas enclosure assembly, and fluid inletline 2145 for returning the coolant to the chiller.

Gas purification loop 2130 of FIG. 25 can have solvent removal system2132 placed upstream of gas purification system 2134, so that inert gascirculated from gas enclosure assembly 1500 passes through solventremoval system 2132 via outlet line 2131. According to variousembodiments, solvent removal system 2132 may be a solvent trappingsystem based on adsorbing solvent vapor from an inert gas passingthrough solvent removal system 2132 of FIG. 25. A bed or beds of asorbent, for example, but not limited by, such as activated charcoal,molecular sieves, and the like, may effectively remove a wide variety oforganic solvent vapors. For various embodiments of a gas enclosureassembly cold trap technology may be employed to remove solvent vaporsin solvent removal system 2132. As previously mentioned, for variousembodiments of a gas enclosure assembly according to the presentteachings, sensors, such as oxygen, water vapor and solvent vaporsensors, may be used to monitor the effective removal of such speciesfrom inert gas continuously circulating through a gas enclosure assemblysystem, such as gas enclosure assembly system 2100 of FIG. 25. Variousembodiments of a solvent removal system can indicate when sorbent, suchas activated carbon, molecular sieves, and the like, has reachedcapacity, so that the bed or beds of sorbent can be regenerated orreplaced. Regeneration of a molecular sieve can involve heating themolecular sieve, contacting the molecular sieve with a forming gas, acombination thereof, and the like. Molecular sieves configured to trapvarious species, including oxygen, water vapor, and solvents, can beregenerated by heating and exposure to a forming gas that compriseshydrogen, for example, a forming gas comprising about 96% nitrogen and4% hydrogen, with said percentages being by volume or by weight.Physical regeneration of activated charcoal can be done using a similarprocedure of heating under an inert environment.

Any suitable gas purification system can be used for gas purificationsystem 2134 of gas purification loop 2130 of FIG. 25. Gas purificationsystems available, for example, from MBRAUN Inc., of Statham, N.H., orInnovative Technology of Amesbury, Mass., may be useful for integrationinto various embodiments of a gas enclosure assembly according to thepresent teachings. Gas purification system 2134 can be used to purifyone or more inert gases in gas enclosure assembly and system 2100, forexample, to purify the entire gas atmosphere within a gas enclosureassembly. As previously mentioned, in order to circulate gas through gaspurification loop 2130, gas purification system 2134 can have a gascirculating unit, such as a fan, blower or motor, and the like. In thatregard, a gas purification system can be selected depending on thevolume of the enclosure, which can define a volumetric flow rate formoving an inert gas through a gas purification system. For variousembodiments of gas enclosure assembly and system having a gas enclosureassembly with a volume of up to about 4 m³; a gas purification systemthat can move about 84 m³/h can be used. For various embodiments of gasenclosure assembly and system having a gas enclosure assembly with avolume of up to about 10 m³; a gas purification system that can moveabout 155 m³/h can be used. For various embodiments of a gas enclosureassembly having a volume of between about 52-114 m³, more than one gaspurification system may be used.

Any suitable gas filters or purifying devices can be included in the gaspurification system 2134 of the present teachings. In some embodiments,a gas purification system can comprise two parallel purifying devices,such that one of the devices can be taken off line for maintenance andthe other device can be used to continue system operation withoutinterruption. In some embodiments, for example, the gas purificationsystem can comprise one or more molecular sieves. In some embodiments,the gas purification system can comprise at least a first molecularsieve, and a second molecular sieve, such that, when one of themolecular sieves becomes saturated with impurities, or otherwise isdeemed not to be operating efficiently enough, the system can switch tothe other molecular sieve while regenerating the saturated ornon-efficient molecular sieve. A control unit can be provided fordetermining the operational efficiency of each molecular sieve, forswitching between operation of different molecular sieves, forregenerating one or more molecular sieves, or for a combination thereof.As previously mentioned, molecular sieves may be regenerated and reused.

Regarding thermal regulation system 2140 of FIG. 25, at least one fluidchiller 2141 can be provided for cooling the gas atmosphere within gasenclosure assembly and system 2100. For various embodiments of a gasenclosure assembly of the present teachings, fluid chiller 2141 deliverscooled fluid to heat exchangers within the enclosure, where inert gas ispassed over a filtration system internal the enclosure. At least onefluid chiller can also be provided with gas enclosure assembly andsystem 2100 to cool heat evolving from an apparatus enclosed within gasenclosure 2100. For example, but not limited by, at least one fluidchiller can also be provided for gas enclosure assembly and system 2100to cool heat evolving from an OLED printing system. Thermal regulationsystem 2140 can comprise heat-exchange or Peltier devices and can havevarious cooling capacities. For example, for various embodiments of agas enclosure assembly and system, a chiller can provide a coolingcapacity of from between about 2 kW to about 20 kW. Fluid chillers 1136and 1138 can chill one or more fluids. In some embodiments, the fluidchillers can utilize a number of fluids as coolant, for example, but notlimited by, water, anti-freeze, a refrigerant, and a combination thereofas a heat exchange fluid. Appropriate leak-free, locking connections canbe used in connecting the associated conduits and system components.

As depicted in FIG. 26 and FIG. 27, the one or more fan filter units canbe configured to provide a substantially laminar flow of gas through theinterior. According to various embodiments of a gas enclosure assemblyaccording to the present teachings, one or more fan units are disposedadjacent a first interior surface of the gas atmosphere enclosure, andthe one or more ductwork inlets are disposed adjacent a second, oppositeinterior surface of the gas atmosphere enclosure. For example, the gasatmosphere enclosure can comprise an interior ceiling and a bottominterior periphery, the one or more fan units can be disposed adjacentthe interior ceiling, and the one or more ductwork inlets can comprise aplurality of inlet openings disposed adjacent the bottom interiorperiphery that are part of a ductwork system, as shown in FIGS. 15-17.

FIG. 26 is a cross-sectional view taken along the length of a gasenclosure assembly and system 2200, according to various embodiments ofthe present teachings. Gas enclosure assembly and system 2200 of FIG. 26can include a gas enclosure 1500, which can house an OLED printingsystem 50, as well as gas purification system 2130 (see also FIG. 25),thermal regulation system 2140, filtration and circulation system 2150and ductwork system 2170. Thermal regulation system 2140 can includefluid chiller 2141, which is in fluid communication with chiller outletline 2143 and with chiller inlet line 2145. Chilled fluid can exit fluidchiller 2141, flow through chiller outlet line 2143, and be deliveredheat exchangers, which for various embodiments of a gas enclosureassembly and system, as shown in FIG. 26, can be located proximal toeach of a plurality of fan filter units. Fluid to can be returned fromthe heat exchangers proximal to the fan filter unit to chiller 2141through chiller inlet line 2145 to be maintained at a constant desiredtemperature. As previously mentioned, chiller outlet line 2141 andchiller inlet line 2143 are in fluid communication with a plurality ofheat exchangers including first heat exchanger 2142, second heatexchanger 2144, and third heat exchanger 2146. According to variousembodiments of a gas enclosure assembly and system as shown in FIG. 26,first heat exchanger 2142, second heat exchanger 2144, and third heatexchanger 2146 are in thermal communication with a first fan filter unit2152, a second fan filter unit 2154, and a third fan filter unit 2156,respectively, of filtration system 2150.

In FIG. 26, the many arrows depict flow to and from the various fanfilter units and also depict flow within ductwork system 2170 thatincludes first ductwork conduit 2173 and second ductwork conduit 2174 asdepicted in the simplified schematic of FIG. 26. First ductwork conduit2173 can receive gas through a first duct inlet 2171 and can exitthrough a first duct outlet 2175. Similarly, second ductwork conduit2174 can receive gas through second duct inlet 2172 exit through secondduct outlet 2176. Additionally, as shown in FIG. 26, ductwork system2170 separates inert gas that is recirculated internally throughfiltration system 2150 by effectively defining space 2180, which is influid communication with gas purification system 2130 via gaspurification outlet line 2131. Such a circulatory system includingvarious embodiments of a ductwork system as described for FIGS. 15-17,provides substantially laminar flow, minimizes turbulent flow, promotescirculation, turnover and filtration of particulate matter of the gasatmosphere in the interior of the enclosure and provides for circulationthrough a gas purification system exterior to a gas enclosure assembly.

FIG. 27 is a cross-sectional view taken along the length of a gasenclosure assembly and system 23000, according to various embodiments ofa gas enclosure assembly according to the present teachings. Like gasenclosure assembly 2200 of FIG. 26, gas enclosure assembly system 2300of FIG. 27 can include a gas enclosure 1500, which can house an OLEDprinting system 50, as well as gas purification system 2130 (see alsoFIG. 25), thermal regulation system 2140, filtration and circulationsystem 2150 and ductwork system 2170. For various embodiments of gasenclosure assembly 2300, thermal regulation system 2140, which caninclude fluid chiller 2141 in fluid communication with chiller outletline 2143 and with chiller inlet line 2145, can be in fluidcommunication with a plurality of heat exchangers, for example, firstheat exchanger 2142, and second heat exchanger 2144, as depicted in FIG.27. According to various embodiments of a gas enclosure assembly andsystem as shown in FIG. 27, various heat exchangers, such as first heatexchanger 2142 and second heat exchanger 2144, can be in thermalcommunication with circulating inert gas by being positioned proximal toduct outlets, such as first duct outlet 2175 and second duct outlet 2176of ductwork system 2170. In that regard, inert gas being returned forfiltration from duct inlets, such as duct inlets, such as first ductinlet 2171 and second duct inlet 2172 of ductwork system 2170 can bethermally regulated prior to being circulated through, for example, afirst fan filter unit 2152, a second fan filter unit 2154, and a thirdfan filter unit 2156, respectively, of filtration system 2150 of FIG.27.

As can be seen from the arrows showing direction of inert gascirculation through the enclosure in FIGS. 26 and 27 the fan filterunits are configured to provide substantially laminar flow downwardlyfrom a top of the enclosure toward the bottom. Fan filter unitsavailable, for example, from Flanders Corporation, of Washington, N.C.,or Envirco Corporation of Sanford, N.C., may be useful for integrationinto various embodiments of a gas enclosure assembly according to thepresent teachings Various embodiments of a fan filter unit can exchangebetween about 350 cubic feet per minute (CFM) to about 700 CFM of inertgas through each unit. As shown in FIGS. 26 and 27, as the fan filterunits are in a parallel and not series arrangement, the amount of inertgas that can be exchanged in a system comprising a plurality of fanfilter units is proportional to the number of units used. Near thebottom of the enclosure the flow of gas is directed toward a pluralityof ductwork inlets, indicated schematically in FIGS. 26 and 27 as firstduct inlet 2171 and second duct inlet 2172. As previously discussed forFIGS. 15-17, positioning the duct inlets substantially at the bottom ofthe enclosure, and causing downward flow of gas from upper fan filterunits facilitates good turnover of the gas atmosphere within theenclosure and promotes thorough turnover and movement of the entire gasatmosphere through the gas purification system used in connection withthe enclosure. By circulating the gas atmosphere through the ductworkand promoting laminar flow and thorough turnover of the gas atmospherein the enclosure using filtration and circulation system 2150, whichductwork separates the inert gas flow for circulation through gaspurification loop 2130, levels of each of a reactive species, such aswater and oxygen, as well as each of a solvent can be maintained invarious embodiments of a gas enclosure assembly at 100 ppm or lower, forexample 1 ppm or lower, for example, at 0.1 ppm or lower.

According to various embodiments of a gas enclosure assembly system usedfor OLED printing systems, the number of fan filter units can beselected in accordance with the physical position of a substrate in aprinting system during processing. Accordingly, though 3 fan filterunits are shown in FIGS. 26 and 27, the number of fan filter units canvary. For example, FIG. 28 is a cross-sectional view taken along thelength of a gas enclosure assembly and system 2400, which is a gasenclosure assembly and system similar to that depicted in FIG. 23 andFIG. 24. Gas enclosure assembly and system 2400 can include gasenclosure assembly 1500, which houses OLED printing system 50 supportedon base 52. Substrate floatation table 54 of OLED printing systemdefines the travel over which a substrate can be moved through system2400 during the OLED printing of a substrate. As such, filtration system2150 of gas enclosure assembly and system 2400 has an appropriate numberof fan filter units; shown as 2151-2155, corresponding to the physicaltravel of a substrate through OLED printing system 50 during processing.Additionally, the schematic section view of FIG. 28 depicts thecontouring of various embodiments of a gas enclosure, which caneffectively decrease the volume of inert gas required during an OLEDprinting process, and at the same time provide ready access to theinterior of gas enclosure 1500; either remotely during processing, forexample, using gloves installed in various gloveports, or directly byvarious removable panels in the case of a maintenance operation.

Various embodiments of a gas enclosure and system can utilize apressurized inert gas recirculation system for the operation of avariety of pneumatically operated devices and apparatuses. Additionally,as previous discussed, embodiments of a gas enclosure assembly of thepresent teachings can be maintained at a slight positive pressurerelative to the external environment, for example, but not limited bybetween about 2 mbarg to about 8 mbarg. Maintaining a pressurized inertgas recirculation system within a gas enclosure assembly system can bechallenging, as it presents a dynamic and ongoing balancing actregarding maintaining a slight positive internal pressure of a gasenclosure assembly and system, while at the same time continuouslyintroducing pressurized gas into a gas enclosure assembly and system.Further, variable demand of various devices and apparatuses can createan irregular pressure profile for various gas enclosure assemblies andsystems of the present teachings. Maintaining a dynamic pressure balancefor a gas enclosure assembly held at a slight positive pressure relativeto the external environment under such conditions can provide for theintegrity of an ongoing OLED printing process.

As shown in FIG. 29, various embodiments of gas enclosure assembly andsystem 3000 can have external gas loop 2500 for integrating andcontrolling inert gas source 2509 and clean dry air (CDA) source 2512for use in various aspects of operation of gas enclosure assembly andsystem 3000. One of ordinary skill in the art will appreciate that gasenclosure assembly and system 3000 can also include various embodimentsof an internal particle filtration and gas circulation system, as wellas various embodiments of an external gas purification system, aspreviously described. In addition to external loop 2500 for integratingand controlling inert gas source 2509 and CDA source 2512, gas enclosureassembly and system 3000 can have compressor loop 2160, which can supplyinert gas for operating various devices and apparatuses that can bedisposed in the interior of gas enclosure assembly and system 3000.

Compressor loop 2160 of FIG. 29 can include compressor 2162, firstaccumulator 2164 and second accumulator 2168, which are configured to bein fluid communication. Compressor 2162 can be configured to compressinert gas withdrawn from gas enclosure assembly 1500 to a desiredpressure. An inlet side of compressor loop 2160 can be in fluidcommunication with gas enclosure assembly 1500 via gas enclosureassembly outlet 2501 through line 2503, having valve 2505 and checkvalve 2507. Compressor loop 2160 can be in fluid communication with gasenclosure assembly 1500 on an outlet side of compressor loop 2160 viaexternal gas loop 2500. Accumulator 2164 can be disposed betweencompressor 2162 and the junction of compressor loop 2160 with externalgas loop 2500 and can be configured to generate a pressure of 5 psig orhigher. Second accumulator 2168 can be in compressor loop 2160 forproviding dampening fluctuations due to compressor piston cycling atabout 60 Hz. For various embodiments of compressor loop 2160, firstaccumulator 2164 can have a capacity of between about 80 gallons toabout 160 gallons, while second accumulator can have a capacity ofbetween about 30 gallons to about 60 gallons. According to variousembodiments of gas enclosure assembly and system 3000, compressor 2162can be a zero ingress compressor. Various types of zero ingresscompressors can operate without leaking atmospheric gases into variousembodiments of a gas enclosure assembly and system of the presentteachings. Various embodiments of a zero ingress compressor can be runcontinuously, for example, during an OLED printing process utilizing theuse of various devices and apparatuses requiring compressed inert gas.

Accumulator 2164 can be configured to receive and accumulate compressedinert gas from compressor 2162. Accumulator 2164 can supply thecompressed inert gas as needed in gas enclosure assembly 1500. Forexample, accumulator 2164 can provide gas to maintain pressure forvarious components of gas enclosure assembly 1500, such as, but notlimited by, one or more of a pneumatic robot, a substrate floatationtable, an air bearing, an air bushing, a compressed gas tool, apneumatic actuator, and combinations thereof. As shown in FIG. 29 forgas enclosure assembly and system 3000, gas enclosure assembly 1500 canhave an OLED printing system 50 enclosed therein. As shown in FIG. 24,OLED printing system 50 can be supported by granite stage 52 and caninclude substrate floatation table 54 for transporting a substrate intoposition in a print head chamber, as well supporting a substrate duringan OLED printing process. Additionally, air bearing 58 supported onbridge 56 can be used in place of, for example, a linear mechanicalbearing. For various embodiments of a gas enclosure and system of thepresent teachings, the use of a variety of pneumatically operateddevices and apparatuses can be provide low-particle generatingperformance, as well as being low maintenance. Compressor loop 2160 canbe configured to continuously supply pressurized inert gas to variousdevices and apparatuses of gas enclosure apparatus 3000. In addition toa supply of pressurized inert gas, substrate floatation table 54 of OLEDprinting system 50, which utilizes air bearing technology, also utilizesvacuum system 2550, which is in communication with gas enclosureassembly 1500 through line 2552 when valve 2554 is in an open position.

A pressurized inert gas recirculation system according to the presentteachings can have pressure-controlled bypass loop 2165 as shown in FIG.29 for compressor loop 2160, which acts to compensate for variabledemand of pressurized gas during use, thereby providing dynamic balancefor various embodiments of a gas enclosure assembly and system of thepresent teachings. For various embodiments of a gas enclosure assemblyand system according to the present teachings, a bypass loop canmaintain a constant pressure in accumulator 2164 without disrupting orchanging the pressure in enclosure 1500. Bypass loop 2165 can have firstbypass inlet valve 2161 on an inlet side of bypass loop 2165, which isclosed unless bypass loop 2165 is used. Bypass loop 2165 can also haveback pressure regulator, which can be used when second valve 2163 isclosed. Bypass loop 2165 can have second accumulator 2168 disposed at anoutlet side of bypass loop 2165. For embodiments of compressor loop 2160utilizing a zero ingress compressor, bypass loop 2165 can compensate forsmall excursions of pressure that can occur over time during use of agas enclosure assembly and system. Bypass loop 2165 can be in fluidcommunication with compressor loop 2160 on an inlet side of bypass loop2165 when bypass inlet valve 2161 is in an opened position. When bypassinlet valve 2161 is opened, inert gas shunted through bypass loop 2165can be recirculated to the compressor if inert gas from compressor loop2160 is not in demand within the interior of gas enclosure assembly1500. Compressor loop 2160 is configured to shunt inert gas throughbypass loop 2165 when a pressure of the inert gas in accumulator 2164exceeds a pre-set threshold pressure. A pre-set threshold pressure foraccumulator 2164 can be from between about 25 psig to about 200 psig ata flow rate of at least about 1 cubic feet per minute (cfm), or frombetween about 50 psig to about 150 psig at a flow rate of at least about1 cubic feet per minute (cfm), or from between about 75 psig to about125 psig at a flow rate of at least about 1 cubic feet per minute (cfm)or between about 90 psig to about 95 psig at a flow rate of at leastabout 1 cubic feet per minute (cfm).

Various embodiments of compressor loop 2160 can utilize a variety ofcompressors other than a zero ingress compressor, such as a variablespeed compressor or a compressor that can be controlled to be in eitheran on or off state. As previously discussed, a zero ingress compressorensures that no atmospheric reactive species can be introduced into agas enclosure assembly and system. As such, any compressor configurationpreventing atmospheric reactive species from being introduced into a gasenclosure assembly and system can be utilized for compressor loop 2160.According to various embodiments, compressor 2162 of gas enclosureassembly and system 3000 can be housed in, for example, but not limitedby, an hermetically-sealed housing. The housing interior can beconfigured in fluid communication with a source of inert gas, forexample, the same inert gas that forms the inert gas atmosphere for gasenclosure assembly 1500. For various embodiments of compressor loop2160, compressor 2162 can be controlled at a constant speed to maintaina constant pressure. In other embodiments of compressor loop 2160 notutilizing a zero ingress compressor, compressor 2162 can be turned offwhen a maximum threshold pressure is reached, and turned on when aminimum threshold pressure is reached

In FIG. 30 for gas enclosure assembly and system 3100, blower loop 2170and blower vacuum loop 2550 are shown for the operation of substratefloatation table 54 of OLED printing system 50, which are housed in gasenclosure assembly 1500. As previously discussed for compressor loop2160, blower loop 2170 can be configured to continuously supplypressurized inert gas to a substrate floatation table 54.

Various embodiments of a gas enclosure assembly and system that canutilize a pressurized inert gas recirculation system can have variousloops utilizing a variety of pressurized gas sources, such as at leastone of a compressor, a blower, and combinations thereof. In FIG. 30 forgas enclosure assembly and system 3100, compressor loop 2160 can be influid communication with external gas loop 2500, which can be used forthe supply of inert gas for high consumption manifold 2525, as well aslow consumption manifold 2513. For various embodiments of a gasenclosure assembly and system according to the present teachings asshown in FIG. 29 for gas enclosure assembly and system 3000, highconsumption manifold 2525 can be used to supply inert gas to variousdevices and apparatuses, such as, but not limited by, one or more of asubstrate floatation table, a pneumatic robot, an air bearing, an airbushing, and a compressed gas tool, and combinations thereof. Forvarious embodiments of a gas enclosure assembly and system according tothe present teachings, low consumption 2513 can be used to supply inertgas to various apparatuses and devises, such as, but not limited by, oneor more of an isolator, and a pneumatic actuator, and combinationsthereof.

For various embodiments of gas enclosure assembly and system 3100,blower loop 2170 can be utilized to supply pressurized inert gas tovarious embodiments of substrate floatation table 54, while compressorloop 2160; in fluid communication with external gas loop 2500, can beutilized to supply pressurized inert gas to, for example, but notlimited by, one or more of a pneumatic robot, an air bearing, an airbushing, and a compressed gas tool, and combinations thereof. Inaddition to a supply of pressurized inert gas, substrate floatationtable 54 of OLED printing system 50, which utilizes air bearingtechnology, also utilizes blower vacuum system 2550, which is incommunication with gas enclosure assembly 1500 through line 2552 whenvalve 2554 is in an open position. Housing 2172 of blower loop 2170 canmaintain first blower 2174 for supplying a pressurized source of inertgas to substrate floatation table 54, and second blower 2550, acting asa vacuum source for substrate floatation table 54, in an inert gasenvironment. Attributes that can make blowers suitable for use as asource of either pressurized inert gas or vacuum for various embodimentsa substrate floatation table include, for example, but not limited by,that they have high reliability; making them low maintenance, havevariable speed control, and have a wide range of flow volumes; variousembodiments capable of providing a volume flow of between about 100 m³/hto about 2,500 m³/h. Various embodiments of blower loop 2170additionally can have first isolation valve 2173 at an inlet end ofcompressor loop 2170, as well as check valve 2175 and a second isolationvalve 2177 at an outlet end of compressor loop 2170. Various embodimentsof blower loop 2170 can have adjustable valve 2176, which can be, forexample, but not limited by, a gate, butterfly, needle or ball valve, aswell as heat exchanger 2178 for maintaining inert gas from blowerassembly 2170 to substrate floatation system 54 at a definedtemperature.

FIG. 30 depicts external gas loop 2500, also shown in FIG. 29, forintegrating and controlling inert gas source 2509 and clean dry air(CDA) source 2512 for use in various aspects of operation of gasenclosure assembly and system 3000 of FIG. 29 and gas enclosure assemblyand system 3100 of FIG. 30. External gas loop 2500 of FIG. 29 and FIG.30 can include at least four mechanical valves. These valves comprisefirst mechanical valve 2502, second mechanical valve 2504, thirdmechanical valve 2506, and fourth mechanical valve 2508. These variousvalves are located at positions in various flow lines that allow controlof both an inert gas, for example, such as nitrogen, any of the noblegases, and any combination thereof, and an air source such as clean dryair (CDA). From a house inert gas source 2509, a house inert gas line2510 extends. House inert gas line 2510 continues to extend linearly aslow consumption manifold line 2512, which is in fluid communication withlow consumption manifold 2513. A cross-line first section 2514 extendsfrom a first flow juncture 2516, which is located at the intersection ofhouse inert gas line 2510, low consumption manifold line 2512, andcross-line first section 2514. Cross-line first section 2514 extends toa second flow juncture 2518. A compressor inert gas line 2520 extendsfrom accumulator 2164 of compressor loop 2160 and terminates at secondflow juncture 2518. A CDA line 2522 extends from a CDA source 2512 andcontinues as high consumption manifold line 2524, which is in fluidcommunication with high consumption manifold 2525. A third flow juncture2526 is positioned at the intersection of a cross-line second section2528, clean dry air line 2522, and high consumption manifold line 2524.Cross-line second section 2528 extends from second flow juncture 2518 tothird flow juncture 2526.

With respect to the description of external gas loop 2500 and inreference to FIG. 31, which is a table of valve positions for variousmodes of operation of a gas enclosure assembly and system, the followingare an overview of some various modes of operation.

The table of FIG. 31 indicates a process mode, in which the valve statescreate an inert gas compressor only mode of operation. In a processmode, as shown in FIG. 30, and indicted for valve states in FIG. 31,first mechanical valve 2502 and third mechanical valve 2506 are inclosed configurations. Second mechanical valve 2504 and fourthmechanical valve 2508 are in open configurations. As a result of theseparticular valve configurations, compressed inert gas is allowed to flowto both the low consumption manifold 2513 and to the high consumptionmanifold 2525. Under normal operation, inert gas from a house inert gassource and clean dry air from a CDA source are prevented from flowing toeither of the low consumption manifold 2513 and to the high consumptionmanifold 2525.

As indicated in FIG. 31, and in reference to FIG. 30, there are a seriesof valve states for maintenance and recovery. Various embodiments of agas enclosure assembly and system of the present teachings may requiremaintenance from time to time, and additionally, recovery from systemfailure. In this particular mode, second mechanical valve 2504 andfourth mechanical valve 2508 are in a closed configuration. Firstmechanical valve 2502 and third mechanical valve 2506 are in openconfigurations. A house inert gas source and a CDA source provide inertgas to be supplied by low consumption manifold 2513 to those componentsthat are low consumption, and additionally have dead volumes that wouldbe difficult to effectively purge during recovery. Examples of suchcomponents include pneumatic actuators. In contrast, those componentsthat are consumption can be supplied CDA during maintenance, by meanshigh consumption manifold 2525. Isolating the compressor using valves2504, 2508, 2530 prevents reactive species, such as oxygen and watervapor from contaminating an inert gas within the compressor andaccumulator.

After maintenance or recovery has been completed, a gas enclosureassembly must be purged through several cycles until various reactiveatmospheric species, such as oxygen and water, have reached sufficientlylow levels for each species of, for example, 100 ppm or lower, forexample, at 10 ppm or lower, at 1.0 ppm or lower, or at 0.1 ppm orlower. As indicated in FIG. 31, and in reference to FIG. 30, during apurge mode, third mechanical valve 2506 is closed and also a fifthmechanical valve 2530 is in a closed configuration. First mechanicalvalve 2502, second mechanical valve 2504, and fourth mechanical valve2508 are in an open configuration. As a result of this particular valveconfiguration, only house inert gas is allowed to flow and is allowed toflow to both low consumption manifold 2513 and high consumption manifold2525.

Both the “no flow” mode and the leak test mode, as indicated in FIG. 31,and in reference to FIG. 30, are modes which are used according to need.The “no flow” mode is a mode having a valve state configuration in whichfirst mechanical valve 2502, second mechanical valve 2504, thirdmechanical valve 2506, and fourth mechanical valve 2508 are all in aclosed configuration. This closed configuration results in a “no flow”mode of the system in which no gas from any of the inert gas, CDA, orcompressor sources can reach either low consumption manifold 2513 orhigh consumption manifold 2525. Such a “no flow mode” can be useful whenthe system is not in use, and may remain idle for an extended period.The leak test mode can be used for detecting leaks in the system. Theleak test mode uses exclusively compressed inert gas, which isolates thesystem from high consumption manifold 2525 of FIG. 30 in order to leakcheck low consumption components, such as isolators and pneumaticactuators, of low consumption manifold 2513. In this leak test mode,first mechanical valve 2502, third mechanical valve 2506, and fourthmechanical valve 2508 are all in a closed configuration. Only secondmechanical valve 2504 is in an open configuration. As a result,compressed nitrogen gas is able to flow from the compressor inert gassource 2519 to low consumption manifold 2513, and there is no gas flowto high consumption manifold 5525.

All publications, patents, and patent applications mentioned in thisspecification are herein incorporated by reference to the same extent asif each individual publication, patent, or patent application wasspecifically and individually indicated to be incorporated by reference.

While embodiments of the present disclosure have been shown anddescribed herein, it will be obvious to those skilled in the art thatsuch embodiments are provided by way of example only. Numerousvariations, changes, and substitutions will now occur to those skilledin the art without departing from the disclosure. It should beunderstood that various alternatives to the embodiments of thedisclosure described herein may be employed in practicing thedisclosure. It is intended that the following claims define the scope ofthe disclosure and that methods and structures within the scope of theseclaims and their equivalents be covered thereby.

What is claimed is:
 1. A method comprising: depositing a material on asubstrate via an inkjet printing system located in an interior of a gasenclosure assembly; while depositing the material: circulating inert gasin the interior of the gas enclosure assembly, and filtering particulatematter from the inert gas circulated in the interior, whereincirculating the inert gas comprises flowing the inert gas throughductwork in the interior of the gas enclosure assembly and along aservice bundle routed through the ductwork, the bundle comprising atleast one of a cable, an electrical wire, a fluid-containing tubing, anda combination thereof operably connected to the inkjet printing system.2. The method of claim 1, further comprising flowing at least a portionof the inert gas from the interior through a gas purification system andback into the interior of the gas enclosure assembly.
 3. The method ofclaim 1, wherein flowing the inert gas through the ductwork entrains oneor more reactive species occluded in a dead volume in the bundle.
 4. Themethod of claim 1, further comprising flowing the inert gas through agas purification system to remove one or more reactive species entrainedby the inert gas during circulating of the inert gas through theinterior.
 5. The method of claim 4, wherein the gas purification systemis exterior to the gas enclosure assembly.
 6. The method of claim 4,wherein flowing the inert gas through the gas purification systemmaintains each of the one or more reactive species at or below aspecified limit.
 7. The method of claim 6, wherein the specified limitis 100 ppm.
 8. The method of claim 6, wherein the specified limit is 0.1ppm.
 9. The method of claim 4, wherein the one or more reactive speciescause contamination, oxidation, and damage of material deposited on thesubstrate and/or the substrate.
 10. The method of claim 4, wherein theone or more reactive species are chosen from water vapor, oxygen,organic solvent vapor, and a combination thereof.
 11. The method ofclaim 1, wherein circulating the inert gas in the interior of the gasenclosure assembly comprises circulating the inert gas in asubstantially laminar flow.
 12. The method of claim 1, wherein the inertgas is selected from nitrogen, a noble gas, and a combination thereof.13. The method of claim 1, wherein depositing the material on thesubstrate comprises depositing a material forming part of an organiclight-emitting device on the substrate.
 14. The method of claim 1,wherein the substrate has a size of about 60 cm×72 cm to about 220cm×250 cm.
 15. The method of claim 1, wherein filtering the particulatematter from the inert gas circulated in the interior maintains theinterior to meet a particulate specification.
 16. The method of claim 1,further comprising floating the substrate above a substrate supportapparatus while depositing the material on the substrate.
 17. The methodof claim 1, further comprising supplying inert gas to at least onepneumatic device in the interior of the gas enclosure assembly whiledepositing the material on the substrate.
 18. The method of claim 1,further comprising lighting the interior using at least one of a coolwhite and yellow spectrum lighting element.
 19. The method of claim 1,wherein depositing the material on the substrate comprises depositingthe material in a pattern on the substrate.